Inventor · disambiguated record
Jonathan S. Hacker
Also filed as: HACKER JONATHAN · HACKER JONATHAN S
23 granted patents·2 pending applications·52 citations·filing 2008–2024
93Inventor score
Top patents by PatentIndex Score
25 records- 0197US9905527B1Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technologyMICRON TECHNOLOGY INC·Filed 2016·Granted Feb 27, 2018·25 cites·22 claims
- 0296US11923329B2Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technologyLODESTAR LICENSING GROUP LLC·Filed 2022·Granted Mar 5, 2024·2 cites·18 claims
- 0392US11527505B2Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technologyMICRON TECHNOLOGY INC·Filed 2020·Granted Dec 13, 2022·2 cites·8 claims
- 0491US10396052B2Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technologyMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 27, 2019·5 cites·20 claims
- 0586US9865578B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 9, 2018·4 cites·21 claims
- 0684US2024222145A1Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0784US2024178175A1Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technologyLODESTAR LICENSING GROUP LLC·Filed 2024·Application pending·0 cites
- 0883US10622223B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 14, 2020·2 cites·15 claims
- 0982US10763131B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 1, 2020·2 cites·16 claims
- 1082US10002840B1Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Jun 19, 2018·3 cites·27 claims
- 1181US10103134B2Methods of manufacturing multi-die semiconductor device packages and related assembliesMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 16, 2018·2 cites·20 claims
- 1276US11004697B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted May 11, 2021·1 cites·15 claims
- 1375US11955346B2Semiconductor device with a multi-layered encapsulant and associated systems, devices, and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 1471US10748857B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 18, 2020·1 cites·16 claims
- 1564US11302653B2Die features for self-alignment during die bondingMICRON TECHNOLOGY INC·Filed 2020·Granted Apr 12, 2022·0 cites·16 claims
- 1664US10847486B2Uniform electrochemical plating of metal onto arrays of pillars having different lateral densities and related technologyMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 24, 2020·0 cites·11 claims
- 1762US11565371B2Systems and methods for forming semiconductor cutting/trimming bladesMICRON TECHNOLOGY INC·Filed 2018·Granted Jan 31, 2023·0 cites·9 claims
- 1862US11402426B2Inductive testing probe apparatus for testing semiconductor die and related systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 1960US7798674B2Cover device for compact flourescent lampsADAPTIVE LIGHTING SOLUTIONS LL·Filed 2008·Granted Sep 21, 2010·3 cites·20 claims
- 2058US10896886B2Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Jan 19, 2021·0 cites·27 claims
- 2156US11094684B2Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topographyMICRON TECHNOLOGY INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 2256US10262961B2Semiconductor devices having discretely located passivation material, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 16, 2019·0 cites·27 claims
- 2354US10852344B2Inductive testing probe apparatus for testing semiconductor die and related systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Dec 1, 2020·0 cites·30 claims
- 2452US10403618B2Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topographyMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·0 cites·17 claims
- 2545US10446431B2Temporary carrier debond initiation, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Oct 15, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →