Inventor · disambiguated record
John Harper
Also filed as: HARPER II JOHN L · HARPER JOHN · HARPER JOHN L
8 granted patents·3 pending applications·13 citations·filing 1994–2024
78Inventor score
Top patents by PatentIndex Score
11 records- 0177US12040246B2Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2020·Granted Jul 16, 2024·1 cites·15 claims
- 0273US9891090B1Measuring cup with cap, grip, and levelerHARPER II JOHN L·Filed 2017·Granted Feb 13, 2018·2 cites·18 claims
- 0369US2024332112A1Chip-scale package architectures containing a die back side metal and a solder thermal interface materialINTEL CORP·Filed 2024·Application pending·0 cites
- 0468US10290569B2Constrained cure component attach process for improved IC package warpage controlINTEL CORP·Filed 2017·Granted May 14, 2019·2 cites·15 claims
- 0568US2024162134A1Varied ball ball-grid-array (bga) packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0663US12494441B2BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling loadINTEL CORP·Filed 2022·Granted Dec 9, 2025·0 cites·25 claims
- 0756USD366565SGolf club head cleanerHARPER JOHN·Filed 1994·Granted Jan 30, 1996·8 cites·1 claims
- 0855US11916003B2Varied ball ball-grid-array (BGA) packagesINTEL CORP·Filed 2019·Granted Feb 27, 2024·0 cites·22 claims
- 0953US2025062168A1Method and Stiffeners for Package Level Warpage ModulationINTEL CORP·Filed 2023·Application pending·0 cites
- 1049US12183688B2Integrated circuit die package stiffeners of metal alloys having exceptionally high CTEINTEL CORP·Filed 2021·Granted Dec 31, 2024·0 cites·21 claims
- 1136US8969786B2Optical proximity switchHARPER JOHN·Filed 2012·Granted Mar 3, 2015·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →