Inventor · disambiguated record
John Heck
Also filed as: HECK JOHN · HECK JOHN M
69 granted patents·19 pending applications·1,353 citations·filing 2002–2024
99Inventor score
Top patents by PatentIndex Score
88 records- 0197US8620164B2Hybrid III-V silicon laser formed by direct bondingHECK JOHN·Filed 2011·Granted Dec 31, 2013·230 cites·18 claims
- 0297US6812814B2Microelectromechanical (MEMS) switching apparatusINTEL CORP·Filed 2003·Granted Nov 2, 2004·82 cites·16 claims
- 0395US10310196B2Monolithic physically displaceable optical waveguidesINTEL CORP·Filed 2013·Granted Jun 4, 2019·33 cites·25 claims
- 0495US9575341B2Solid state LIDAR circuit with waveguides tunable to separate phase offsetsINTEL CORP·Filed 2014·Granted Feb 21, 2017·46 cites·19 claims
- 0595US6852926B2Packaging microelectromechanical structuresINTEL CORP·Filed 2002·Granted Feb 8, 2005·120 cites·18 claims
- 0695US6713314B2Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonatorINTEL CORP·Filed 2002·Granted Mar 30, 2004·108 cites·11 claims
- 0795US6686820B1Microelectromechanical (MEMS) switching apparatusINTEL CORP·Filed 2002·Granted Feb 3, 2004·52 cites·48 claims
- 0894US9823118B2Low power, high resolution solid state LIDAR circuitINTEL CORP·Filed 2015·Granted Nov 21, 2017·32 cites·20 claims
- 0993US10281322B2Low power, high resolution solid state LIDAR circuit having a modulator to modulate a bit sequence onto a carrier frequency of a received optical signalINTEL CORP·Filed 2017·Granted May 7, 2019·19 cites·20 claims
- 1092US6903452B2Packaging microelectromechanical structuresINTEL CORP·Filed 2003·Granted Jun 7, 2005·92 cites·10 claims
- 1192US6806543B2Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detectionINTEL CORP·Filed 2002·Granted Oct 19, 2004·41 cites·30 claims
- 1291US8803268B2Vertical mirror in a silicon photonic circuitINTEL CORP·Filed 2013·Granted Aug 12, 2014·6 cites·7 claims
- 1391US7321275B2Ultra-low voltage capable zipper switchINTEL CORP·Filed 2005·Granted Jan 22, 2008·30 cites·20 claims
- 1490US7368808B2MEMS packaging using a non-silicon substrate for encapsulation and interconnectionINTEL CORP·Filed 2003·Granted May 6, 2008·60 cites·7 claims
- 1590US7183622B2Module integrating MEMS and passive componentsINTEL CORP·Filed 2004·Granted Feb 27, 2007·61 cites·33 claims
- 1689US9897827B1Feedback controlled closed loop on-chip isolatorINTEL CORP·Filed 2016·Granted Feb 20, 2018·4 cites·9 claims
- 1789US8435809B2Vertical mirror in a silicon photonic circuitHECK JOHN·Filed 2009·Granted May 7, 2013·11 cites·15 claims
- 1889US7061099B2Microelectronic package having chamber sealed by material including one or more intermetallic compoundsINTEL CORP·Filed 2004·Granted Jun 13, 2006·50 cites·24 claims
- 1988US11222987B2Optical receiver employing a metasurface collection lens having concentric belts or ringsINTEL CORP·Filed 2018·Granted Jan 11, 2022·3 cites·23 claims
- 2088US10914874B2Metasurface devices for display and photonics devicesINTEL CORP·Filed 2020·Granted Feb 9, 2021·2 cites·21 claims
- 2188US9791641B2Inverted 45° mirror for photonic integrated circuitsHECK JOHN·Filed 2015·Granted Oct 17, 2017·6 cites·8 claims
- 2287US10564330B2Metasurface devices for display and photonics devicesINTEL CORP·Filed 2018·Granted Feb 18, 2020·4 cites·23 claims
- 2387US7324350B2MEMS RF switch module including a vertical viaINTEL CORP·Filed 2006·Granted Jan 29, 2008·13 cites·3 claims
- 2486US11894474B2Silicon photonic integrated lens compatible with wafer processingINTEL CORP·Filed 2019·Granted Feb 6, 2024·5 cites·11 claims
- 2586US7243833B2Electrically-isolated interconnects and seal rings in packages using a solder preformINTEL CORP·Filed 2005·Granted Jul 17, 2007·9 cites·19 claims
- 2685US7687297B2Forming a cantilever assembly for vertical and lateral movementINTEL CORP·Filed 2007·Granted Mar 30, 2010·14 cites·11 claims
- 2784US10466515B2On-chip optical isolatorINTEL CORP·Filed 2016·Granted Nov 5, 2019·3 cites·14 claims
- 2884US9239340B2Optomechanical sensor for accelerometry and gyroscopyINTEL CORP·Filed 2013·Granted Jan 19, 2016·10 cites·17 claims
- 2984US6673697B2Packaging microelectromechanical structuresINTEL CORP·Filed 2002·Granted Jan 6, 2004·49 cites·10 claims
- 3083US11175451B2Mechanisms for refractive index tuning semiconductor photonic devicesINTEL CORP·Filed 2020·Granted Nov 16, 2021·2 cites·21 claims
- 3182US10877352B2Semiconductor photonic devices using phase change materialsINTEL CORP·Filed 2019·Granted Dec 29, 2020·2 cites·18 claims
- 3282US8465698B2Microfluidic apparatus with integrated porous-substrate/sensor for real-time (BIO) chemical molecule detectionYAMAKAWA MINEO·Filed 2011·Granted Jun 18, 2013·6 cites·7 claims
- 3382US8084282B2Wafer-level In-P Si bonding for silicon photonic apparatusHECK JOHN·Filed 2010·Granted Dec 27, 2011·6 cites·12 claims
- 3482US7283024B2MEMS switch stopper bumps with adjustable heightINTEL CORP·Filed 2003·Granted Oct 16, 2007·25 cites·17 claims
- 3581US7869334B2Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperaturesINTEL CORP·Filed 2007·Granted Jan 11, 2011·7 cites·7 claims
- 3681US7170155B2MEMS RF switch module including a vertical viaINTEL CORP·Filed 2003·Granted Jan 30, 2007·27 cites·18 claims
- 3780US7510907B2Through-wafer vias and surface metallization for coupling theretoINTEL CORP·Filed 2005·Granted Mar 31, 2009·11 cites·15 claims
- 3878US6943419B2Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonatorINTEL CORP·Filed 2004·Granted Sep 13, 2005·21 cites·13 claims
- 3977US12081276B2Optical coherent receiver on a chipINTEL CORP·Filed 2020·Granted Sep 3, 2024·1 cites·15 claims
- 4077US6967548B2Microelectromechanical (MEMS) switching apparatusINTEL CORP·Filed 2004·Granted Nov 22, 2005·15 cites·28 claims
- 4176US10996408B2Optical device including buried optical waveguides and output couplersINTEL CORP·Filed 2019·Granted May 4, 2021·1 cites·14 claims
- 4275US9195007B2Inverted 45 degree mirror for photonic integrated circuitsHECK JOHN·Filed 2012·Granted Nov 24, 2015·3 cites·17 claims
- 4374US8018821B2Protection layers for media protection during fabrication of probe memory deviceINTEL CORP·Filed 2008·Granted Sep 13, 2011·2 cites·19 claims
- 4473US7358615B2Microelectronic package having multiple conductive paths through an opening in a support substrateINTEL CORP·Filed 2005·Granted Apr 15, 2008·6 cites·23 claims
- 4572US11908687B2III-N multichip modules and methods of fabricationINTEL CORP·Filed 2021·Granted Feb 20, 2024·0 cites·17 claims
- 4672US9099352B2Semiconductor substrate for an optical receiverHECK JOHN·Filed 2011·Granted Aug 4, 2015·3 cites·22 claims
- 4770US8681596B2Seek-scan probe (SSP) memory with sharp probe tips formed at CMOS-compatible temperaturesHECK JOHN·Filed 2010·Granted Mar 25, 2014·2 cites·12 claims
- 4870US2024388366A1Optical coherent receiver on a chipINTEL CORP·Filed 2024·Application pending·0 cites
- 4969US9500827B2Apparatus, method and system for spectrometry with a displaceable waveguide structureINTEL CORP·Filed 2014·Granted Nov 22, 2016·2 cites·20 claims
- 5067US9778042B2Opto-mechanical inertial sensorINTEL CORP·Filed 2013·Granted Oct 3, 2017·2 cites·24 claims
Showing the top 50 of 88 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →