Inventor · disambiguated record
Jorge M. Hernandez
Also filed as: HERNANDEZ JORGE · HERNANDEZ JORGE M
31 granted patents·1,598 citations·filing 1983–2015
98Inventor score
Files withROGERS CORP22CIRCUIT COMPONENTS INC4BASTION TECH INC2HERNANDEZ JORGE M1MICRO SUBSTRATES CORP1
Top patents by PatentIndex Score
31 records- 0195US5065284AMultilayer printed wiring boardROGERS CORP·Filed 1988·Granted Nov 12, 1991·100 cites·13 claims
- 0293US5095402AInternally decoupled integrated circuit packageROGERS CORP·Filed 1990·Granted Mar 10, 1992·191 cites·28 claims
- 0392USRE35064EMultilayer printed wiring boardCIRCUIT COMPONENTS INC·Filed 1993·Granted Oct 17, 1995·95 cites·13 claims
- 0488USRE35733EDevice for interconnecting integrated circuit packages to circuit boardsCIRCUIT COMPONENTS INC·Filed 1994·Granted Feb 17, 1998·101 cites·17 claims
- 0588US4706162AMultilayer capacitor elementsROGERS CORP·Filed 1987·Granted Nov 10, 1987·54 cites·14 claims
- 0687US4475143ADecoupling capacitor and method of manufacture thereofROGERS CORP·Filed 1983·Granted Oct 2, 1984·39 cites·31 claims
- 0786US5065281AMolded integrated circuit package incorporating heat sinkROGERS CORP·Filed 1990·Granted Nov 12, 1991·99 cites·16 claims
- 0885US4734818ADecoupling capacitor for surface mounted leadless chip carriers, surface mounted leaded chip carriers and Pin Grid Array packagesROGERS CORP·Filed 1987·Granted Mar 29, 1988·46 cites·40 claims
- 0983US5832598AMethod of making microwave circuit packageCIRCUIT COMPONENTS INC·Filed 1996·Granted Nov 10, 1998·89 cites·38 claims
- 1083US5272590AIntegrated circuit package having an internal cavity for incorporating decoupling capacitorHERNANDEZ JORGE M·Filed 1990·Granted Dec 21, 1993·87 cites·21 claims
- 1182US4908258AHigh dielectric constant flexible sheet materialROGERS CORP·Filed 1988·Granted Mar 13, 1990·37 cites·13 claims
- 1281US4994936AMolded integrated circuit package incorporating decoupling capacitorROGERS CORP·Filed 1990·Granted Feb 19, 1991·70 cites·22 claims
- 1381US4667267ADecoupling capacitor for pin grid array packageROGERS CORP·Filed 1986·Granted May 19, 1987·67 cites·45 claims
- 1478US10066643B2Multiple gas generator driven pressure supplyBASTION TECH INC·Filed 2015·Granted Sep 4, 2018·3 cites·20 claims
- 1577US4853826ALow inductance decoupling capacitorROGERS CORP·Filed 1988·Granted Aug 1, 1989·48 cites·27 claims
- 1676US4734819ADecoupling capacitor for surface mounted leadless chip carrier, surface mounted leaded chip carrier and pin grid array packageROGERS CORP·Filed 1987·Granted Mar 29, 1988·56 cites·39 claims
- 1775US4748537ADecoupling capacitor and method of formation thereofROGERS CORP·Filed 1987·Granted May 31, 1988·41 cites·63 claims
- 1874US4853827AHigh dielectric multilayer capacitorROGERS CORP·Filed 1988·Granted Aug 1, 1989·31 cites·16 claims
- 1973US5422782AMultiple resonant frequency decoupling capacitorCIRCUIT COMPONENTS INC·Filed 1992·Granted Jun 6, 1995·36 cites·14 claims
- 2073US4989117AMolded integrated circuit package incorporating thin decoupling capacitorROGERS CORP·Filed 1990·Granted Jan 29, 1991·49 cites·16 claims
- 2172US10267264B2Monopropellant driven hydraulic pressure supplyBASTION TECH INC·Filed 2015·Granted Apr 23, 2019·2 cites·20 claims
- 2272US4754366ADecoupling capacitor for leadless surface mounted chip carrierROGERS CORP·Filed 1987·Granted Jun 28, 1988·30 cites·13 claims
- 2372US4626958ADecoupling capacitor for Pin Grid Array packageROGERS CORP·Filed 1985·Granted Dec 2, 1986·32 cites·34 claims
- 2471US4658327ADecoupling capacitor for surface mounted chip carrierROGERS CORP·Filed 1985·Granted Apr 14, 1987·20 cites·32 claims
- 2569US5707575AMethod for filling vias in ceramic substrates with composite metallic pasteMICRO SUBSTRATES CORP·Filed 1994·Granted Jan 13, 1998·50 cites·2 claims
- 2669US5034850AThin decoupling capacitor for mounting under integrated circuit packageROGERS CORP·Filed 1990·Granted Jul 23, 1991·39 cites·24 claims
- 2764US6426686B1Microwave circuit packages having a reduced number of vias in the substrateMICROSUBSTRATES CORP·Filed 1999·Granted Jul 30, 2002·34 cites·18 claims
- 2859US4594641ADecoupling capacitor and method of formation thereofROGERS CORP·Filed 1985·Granted Jun 10, 1986·17 cites·26 claims
- 2958US4630170ADecoupling capacitor and method of manufacture thereofROGERS CORP·Filed 1985·Granted Dec 16, 1986·19 cites·38 claims
- 3050US5051542ALow impedance bus barROGERS CORP·Filed 1988·Granted Sep 24, 1991·13 cites·8 claims
- 3137US4873612ATemperature stable multilayer capacitorROGERS CORP·Filed 1988·Granted Oct 10, 1989·3 cites·24 claims
Join the waitlist — get patent alerts
Get an alert when Jorge M. Hernandez files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →