Inventor · disambiguated record
Jongpil Ho
Also filed as: HO JONGPIL
0 granted patents·8 pending applications·0 citations·filing 2024–2024
Files withSAMSUNG SDI CO LTD8
Top patents by PatentIndex Score
8 records- 0168US2025123568A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0268US2025224682A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0365US2024393694A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0465US2025044696A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0563US2024393684A1Method of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0663US2024393698A1Composition for removing edge beads from metal-containing resists, developer composition of metal-containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0761US2025230355A1Composition for removing edge bead from metal containing resists, developer composition of metal containing resists, and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0856US2024385522A1Composition for removing edge beads from metal containing resists, and method of forming patterns including step of removing edge beads utilizing the composition, and a system of forming patternsSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →