Inventor · disambiguated record

John N. Hodul

Also filed as: HODUL JOHN N

0 granted patents·2 pending applications·0 citations·filing 2025–2025

Technology areasH10W

Files withLAIRD TECHNOLOGIES INC2

Top patents by PatentIndex Score

2 records

0151US2025259966A1Controlling Bond Line Thickness (BLT) For Metal AmalgamsLAIRD TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
0251US2025257432A1Rheology controlled metal amalgams by including non-refractory filler particlesLAIRD TECHNOLOGIES INC·Filed 2025·Application pending·0 cites

Join the waitlist — get patent alerts

Get an alert when John N. Hodul files or is granted a new patent.

We store only your email — no account needed. See our privacy policy.

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →