Inventor · disambiguated record
Jongpa Hong
Also filed as: HONG JONGPA
4 granted patents·6 pending applications·7 citations·filing 2020–2024
66Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD10
Top patents by PatentIndex Score
10 records- 0191US11842982B2Semiconductor package with curing layer between semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 12, 2023·3 cites·17 claims
- 0290US12074142B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·2 cites·20 claims
- 0388US11158594B2Semiconductor packages having improved reliability in bonds between connection conductors and padsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 26, 2021·2 cites·20 claims
- 0471US2024371835A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0563US11676925B2Semiconductor packages having improved reliability in bonds between connection conductors and pads and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 0659US2025192082A1Semiconductor package including stacked chipsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0758US2025273644A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0855US2024297150A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0954US2025192083A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1049US2024222330A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →