Inventor · disambiguated record
Jong-Taek Hwang
Also filed as: HWANG JONG TAEK
10 granted patents·6 pending applications·9 citations·filing 2006–2013
81Inventor score
Top patents by PatentIndex Score
16 records- 0164US7541675B2Semiconductor device including fluorine diffusion barrier layer and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2007·Granted Jun 2, 2009·3 cites·12 claims
- 0261US8987034B2Backside illumination CMOS image sensor and method of manufacturing the sameDONGBU HITEK CO LTD·Filed 2013·Granted Mar 24, 2015·0 cites·20 claims
- 0360US7696080B2Method for manufacturing SIP semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Granted Apr 13, 2010·2 cites·20 claims
- 0459US7501326B2Method for forming isolation layer of semiconductor deviceDONGBU ELECTRONICS CO LTD·Filed 2006·Granted Mar 10, 2009·2 cites·14 claims
- 0556US7902669B2Semiconductor device and method for manufacturing the sameDONGBU HITEK CO LTD·Filed 2008·Granted Mar 8, 2011·1 cites·10 claims
- 0655US7977792B2Semiconductor deviceDONGBU HITEK CO LTD·Filed 2007·Granted Jul 12, 2011·1 cites·9 claims
- 0753US7977143B2CMOS image sensor and fabricating method thereofDONGBU HITEK CO LTD·Filed 2008·Granted Jul 12, 2011·0 cites·20 claims
- 0853US7919351B2CMOS image sensor with multi-layered planarization layer and method for fabricating the sameDONGBU HITEK CO LTD·Filed 2008·Granted Apr 5, 2011·0 cites·17 claims
- 0948US8053362B2Method of forming metal electrode of system in packageDONGBU HITEK CO LTD·Filed 2008·Granted Nov 8, 2011·0 cites·19 claims
- 1042US2007152341A1Copper wiring protected by capping metal layer and method for forming for the sameDONGBU ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1142US2007273003A1Semiconductor device and manufacturing method thereofDONGBU HITEK CO LTD·Filed 2007·Application pending·0 cites
- 1241US8760843B2Capacitive device and method for fabricating the sameHWANG JONG TAEK·Filed 2012·Granted Jun 24, 2014·0 cites·18 claims
- 1341US2008272452A1Image sensor and method for manufacturing the sameHWANG JONG-TAEK·Filed 2008·Application pending·0 cites
- 1434US2008012136A1Metal Interconnection Structure of Semiconductor Device and Method for Manufacturing the SameHWANG JONG TAEK·Filed 2007·Application pending·0 cites
- 1534US2008157390A1Method of forming low-k dielectric layer and structure thereofHWANG JONG TAEK·Filed 2007·Application pending·0 cites
- 1634US2008017928A1Semiconductor Device and Method for Manufacturing the SameHWANG JONG TAEK·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →