Inventor · disambiguated record
John O. Jacobson
Also filed as: JACOBSON JOHN · JACOBSON JOHN O
61 granted patents·2,816 citations·filing 1995–2006
99Inventor score
Files withMICRON TECHNOLOGY INC61
Top patents by PatentIndex Score
61 records- 0198US5593927AMethod for packaging semiconductor diceMICRON TECHNOLOGY INC·Filed 1995·Granted Jan 14, 1997·342 cites·19 claims
- 0297US6462423B1Flip-chip with matched lines and ground planeMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 8, 2002·126 cites·38 claims
- 0397US5952840AApparatus for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Sep 14, 1999·128 cites·21 claims
- 0496US6208157B1Method for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·120 cites·7 claims
- 0595US6420892B1Calibration target for calibrating semiconductor wafer test systemsMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 16, 2002·62 cites·16 claims
- 0695US5931685AInterconnect for making temporary electrical connections with bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 3, 1999·158 cites·24 claims
- 0795US5915977ASystem and interconnect for making temporary electrical connections with bumped semiconductor componentsMICRON TECHNOLOGY INC·Filed 1998·Granted Jun 29, 1999·164 cites·24 claims
- 0895US5894218AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 13, 1999·137 cites·42 claims
- 0995US5893726ASemiconductor package with pre-fabricated cover and method of fabricationMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 13, 1999·174 cites·23 claims
- 1094US6247629B1Wire bond monitoring system for layered packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 19, 2001·144 cites·9 claims
- 1194US6239590B1Calibration target for calibrating semiconductor wafer test systemsMICRON TECHNOLOGY INC·Filed 1998·Granted May 29, 2001·70 cites·28 claims
- 1294US6072326ASystem for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 1997·Granted Jun 6, 2000·102 cites·24 claims
- 1392US6057597ASemiconductor package with pre-fabricated coverMICRON TECHNOLOGY INC·Filed 1998·Granted May 2, 2000·107 cites·27 claims
- 1491US6553276B2Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 22, 2003·48 cites·35 claims
- 1590US6362637B2Apparatus for testing semiconductor wafers including base with contact members and terminal contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 26, 2002·61 cites·20 claims
- 1690US5907492AMethod for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1997·Granted May 25, 1999·81 cites·26 claims
- 1789US6900459B2Apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 2002·Granted May 31, 2005·28 cites·42 claims
- 1889US6396291B1Method for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted May 28, 2002·40 cites·20 claims
- 1987US6363295B1Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 26, 2002·64 cites·35 claims
- 2087US6064216AApparatus for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1999·Granted May 16, 2000·50 cites·20 claims
- 2186US6064194AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1996·Granted May 16, 2000·51 cites·14 claims
- 2285US6492187B1Method for automatically positioning electronic die within component packagesMICRON TECHNOLOGY INC·Filed 2000·Granted Dec 10, 2002·21 cites·6 claims
- 2383US7155300B2Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 26, 2006·25 cites·20 claims
- 2482US5955877AMethod and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 21, 1999·40 cites·7 claims
- 2581US7012811B1Method of tuning a multi-path circuitMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 14, 2006·28 cites·32 claims
- 2680US7120513B1Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 10, 2006·26 cites·102 claims
- 2779US7561938B2Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairsMICRON TECHNOLOGY INC·Filed 2006·Granted Jul 14, 2009·7 cites·24 claims
- 2879US6407570B1Interconnect for testing semiconductor components having support members for preventing component flexureMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 18, 2002·17 cites·22 claims
- 2978US6687989B1Method for fabricating interconnect having support members for preventing component flexureMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 10, 2004·15 cites·30 claims
- 3076US6045026AUtilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 4, 2000·23 cites·47 claims
- 3175US6296171B1Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 2, 2001·22 cites·10 claims
- 3273US6703714B2Methods for fabricating flip-chip devices and preventing coupling between signal interconnectionsMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 9, 2004·16 cites·13 claims
- 3373US6627999B2Flip-chip with matched signal lines, ground plane and ground bumps adjacent signal bumpsMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 30, 2003·17 cites·43 claims
- 3472US6369600B2Test carrier for testing semiconductor components including interconnect with support members for preventing component flexureMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 9, 2002·23 cites·20 claims
- 3570US6064221AMethod of temporarily securing a die to a burn-in carrierMICRON TECHNOLOGY INC·Filed 1997·Granted May 16, 2000·24 cites·7 claims
- 3669US6419143B2Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 16, 2002·8 cites·10 claims
- 3769US5786632ASemiconductor packageMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 28, 1998·32 cites·12 claims
- 3868US6085962AWire bond monitoring system for layered packagesMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 11, 2000·29 cites·9 claims
- 3965US6427899B2Utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 6, 2002·6 cites·20 claims
- 4065US6210984B1Method and apparatus for automatically positioning electronic dice within component packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·17 cites·11 claims
- 4164US6150828AMethod and apparatus for automatically positioning electronic dice with component packagesMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 21, 2000·16 cites·22 claims
- 4262US6619532B2Methods to utilize ultrasonic energy to reduce the initial contact forces in known-good-die or permanent contact systemsMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·5 cites·10 claims
- 4362US6544461B1Test carrier with molded interconnect for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 8, 2003·7 cites·21 claims
- 4460US6538463B2Semiconductor die and retaining fixtureMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 25, 2003·5 cites·5 claims
- 4560US6380756B1Burin carrier and semiconductor die assemblyMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 30, 2002·5 cites·5 claims
- 4659US5920513APartial replacement of partially defective memory devicesMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 6, 1999·14 cites·4 claims
- 4758US6998334B2Semiconductor devices with permanent polymer stencil and method for manufacturing the sameMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 14, 2006·19 cites·73 claims
- 4858US6713879B2Semiconductor substract with substantially matched linesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 30, 2004·6 cites·20 claims
- 4958US6353326B2Test carrier with molded interconnect for testing semiconductor componentsMICRON TECHNOLOGY INC·Filed 1998·Granted Mar 5, 2002·15 cites·21 claims
- 5055US5895222AEncapsulant dam standoff for shell-enclosed die assembliesMICRON TECHNOLOGY INC·Filed 1997·Granted Apr 20, 1999·17 cites·21 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when John O. Jacobson files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →