Inventor · disambiguated record
Jong-Kak Jang
Also filed as: JANG JONG-KAK
4 granted patents·0 citations·filing 2009–2023
56Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0173US11929262B2Stack package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 12, 2024·0 cites·20 claims
- 0263US11651975B2Stack package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 16, 2023·0 cites·14 claims
- 0354US10770311B2Stack package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·16 claims
- 0439US8013432B2Package substrate, semiconductor package having the package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 6, 2011·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →