Inventor · disambiguated record
Joonho Jun
Also filed as: JUN JOONHO
4 granted patents·10 pending applications·4 citations·filing 2020–2025
63Inventor score
Files withSAMSUNG ELECTRONICS CO LTD14
Top patents by PatentIndex Score
14 records- 0193US11222873B2Semiconductor packages including stacked substrates and penetration electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 11, 2022·3 cites·20 claims
- 0291US11935873B2Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 19, 2024·1 cites·17 claims
- 0371US11621250B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 4, 2023·0 cites·20 claims
- 0457US2025120099A1Memory device and a memory system including the memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0554US2024387495A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0654US2024347524A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0754US2024427715A1Optical memory module and optical computing system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0852US2025013366A1Memory device including content addressable memory and method of inputting and outputting data thereofSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0952US2023420336A1Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1052US2025062303A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1150US2024371831A1Semiconductor apparatus using both surfaces of a wafer and manufacturing method of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1249US11688707B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·18 claims
- 1349US2025329367A1Memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1446US2025372580A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Joonho Jun files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →