Inventor · disambiguated record
Joo Hwan Jung
Also filed as: JUNG JOO HWAN
17 granted patents·2 pending applications·70 citations·filing 2014–2023
90Inventor score
Top patents by PatentIndex Score
19 records- 0197US9875970B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 23, 2018·46 cites·18 claims
- 0292US10026678B1Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·8 cites·18 claims
- 0384US10242973B2Fan-out-semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 26, 2019·4 cites·30 claims
- 0483US11758655B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 12, 2023·1 cites·15 claims
- 0583US11576261B2Connection structure embedded substrateSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 7, 2023·1 cites·31 claims
- 0678US10153235B2Image sensor device and image sensor module comprising the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 11, 2018·3 cites·17 claims
- 0773US9420709B2Coreless board for semiconductor package, method of manufacturing the same, and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Aug 16, 2016·3 cites·20 claims
- 0871US11075175B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 27, 2021·1 cites·14 claims
- 0970US10283439B2Fan-out semiconductor package including electromagnetic interference shielding layerSAMSUNG ELECTRO MECH·Filed 2018·Granted May 7, 2019·1 cites·10 claims
- 1067US10833040B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·1 cites·11 claims
- 1167US10403562B2Fan-out semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Sep 3, 2019·1 cites·20 claims
- 1263US11532572B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 1360US11751335B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Sep 5, 2023·0 cites·18 claims
- 1457US12336098B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1557US2024172368A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1654US11521922B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 1751US10199329B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 1849US2015156891A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1945US10833070B2Fan-out semiconductor package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Joo Hwan Jung files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →