Inventor · disambiguated record
Jong Rip Kim
Also filed as: KIM JONG RIP · KIM JONG-TAE
10 granted patents·8 pending applications·19 citations·filing 2004–2020
83Inventor score
Top patents by PatentIndex Score
18 records- 0184US10566289B2Fan-out semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 18, 2020·4 cites·36 claims
- 0283US9929100B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Mar 27, 2018·5 cites·22 claims
- 0381US10600748B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Mar 24, 2020·3 cites·33 claims
- 0474US8198542B2Flexible printed circuit board and method of manufacturing the sameLEE KYUNG HO·Filed 2008·Granted Jun 12, 2012·5 cites·6 claims
- 0567US11011482B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 18, 2021·0 cites·15 claims
- 0666US8832929B2Method of manufacturing a flexible printed circuit boardLEE KYUNG HO·Filed 2012·Granted Sep 16, 2014·1 cites·2 claims
- 0761US10448512B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2015·Granted Oct 15, 2019·1 cites·14 claims
- 0855US10714437B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jul 14, 2020·0 cites·20 claims
- 0952US2019385956A1Semiconductor chipSAMSUNG ELECTRO MECH·Filed 2019·Application pending·0 cites
- 1048US2014027163A1Printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1145US10104767B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 16, 2018·0 cites·16 claims
- 1244US2016276292A1Semiconductor chipSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1342US2015083476A1Device embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1440US9786573B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 10, 2017·0 cites·11 claims
- 1538US2004250407A1Device comprising components vertically stacked thereon and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
- 1637US2018138127A1Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 1733US2015348918A1Package substrate, package, package on package and manufacturing method of package substrateSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1832US2016270232A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →