Inventor · disambiguated record
Joonsung Kim
Also filed as: KIM JOONSUNG
20 granted patents·14 pending applications·8 citations·filing 2011–2024
89Inventor score
Top patents by PatentIndex Score
34 records- 0192US11735532B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 22, 2023·3 cites·14 claims
- 0286US11355445B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 7, 2022·2 cites·20 claims
- 0376US2025106083A1Apparatus and method for effectively mapping reference signal for v2x communication in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0475US11127646B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·2 cites·20 claims
- 0575US2025069979A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0674US12176262B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·16 claims
- 0772US2024363542A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0871US11452770B2Recombinant vaccinia virus and use thereofKOLON LIFE SCIENCE INC·Filed 2017·Granted Sep 27, 2022·1 cites·11 claims
- 0968US12284066B2Apparatus and method for effectively mapping reference signal for V2X communication in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 22, 2025·0 cites·20 claims
- 1066US12438133B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·15 claims
- 1165US12159833B2Fan-out semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 3, 2024·0 cites·20 claims
- 1265US11968648B2Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 23, 2024·0 cites·19 claims
- 1364US11798862B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·0 cites·19 claims
- 1461US12062617B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·20 claims
- 1560US11791230B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·20 claims
- 1659US12283577B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·20 claims
- 1758US2025081457A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1857US11574868B2Fan-out semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 7, 2023·0 cites·20 claims
- 1957US2024243053A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2057US2023161937A1Mask layout design method, mask and integrated circuit manufacturing methods, masks and integrated circuitsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2155US11689262B2Communication device for performing beamforming and operating method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·19 claims
- 2255US2024186231A1Semiconductor package including a redistribution structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2354US2024065002A1Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2453US2024038642A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2552US12439603B2Semiconductor device including separate upper channel structures and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 2652US2023024655A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2750US11854912B2Semiconductor package including a chip pad having a connection portion and test portion in a first surface of the chip padSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2848US11503569B2Apparatus and method for efficiently transceiving PSFCH for V2X communication in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 15, 2022·0 cites·16 claims
- 2947US11569957B2Method and apparatus for transmitting and receiving downlink control channel in shortened transmission time intervalsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·19 claims
- 3046US11158581B2Semiconductor package having semiconductor chip between first and second redistribution layersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·16 claims
- 3141US2012160556A1Circuit board and method of manufacturing the sameKIM JOONSUNG·Filed 2011·Application pending·0 cites
- 3237US2019255152A1Composition for alleviating or treating painKOLON LIFE SCIENCE INC·Filed 2017·Application pending·0 cites
- 3337US2012163752A1Method for manufacturing printed circuit board with optical waveguidesKIM SANGHOON·Filed 2011·Application pending·0 cites
- 3437US2022347244A1Recombinant vaccinia virus and pharmaceutical composition comprising sameKOLON LIFE SCIENCE INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →