Inventor · disambiguated record
Jongwan Kim
Also filed as: KIM JONGWAN
12 granted patents·14 pending applications·3 citations·filing 2003–2025
81Inventor score
Files withSAMSUNG ELECTRONICS CO LTD20TEXAS INSTRUMENTS INC2KOREA ADVANCED INST SCI & TECH1S BIOMEDICS1SAMSUNG SDI CO LTD1
Top patents by PatentIndex Score
26 records- 0185US11334457B1Semiconductor memory device and memory system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·3 cites·20 claims
- 0270US2024347401A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0368US12132007B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 29, 2024·0 cites·18 claims
- 0466US2024170710A1Button cellSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 0565US2025253163A1Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0664US2025029636A1Restart of an ac-to-dc converter upon a temporary drop-out of an ac voltageTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0763US12456660B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·17 claims
- 0862US12463126B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 4, 2025·0 cites·20 claims
- 0962US12308253B2Molded product for semiconductor strip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1062US11581266B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·15 claims
- 1160US12143030B2Restart of an AC-to-DC converter upon a temporary drop-out of an AC voltageTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·19 claims
- 1259US12057357B2Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recessesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·18 claims
- 1358US12494439B2Semiconductor packages having fixing membersSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·20 claims
- 1457US12205925B2Semiconductor package having package substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·20 claims
- 1556US2024420972A1Semiconductor molding apparatus and compression molding method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1655US2025329691A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1754US12400970B2Semiconductor package including electromagnetic shield structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·20 claims
- 1854US2024096748A1Chip protection deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1953US2024079342A1Semiconductor package and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2052US2024128190A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2152US2025201641A1Semiconductor packages having a substrate with connecting portionsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2249US2025239321A1Memory device and test method for the memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2339US2021093673A1Method For Separation Of Dopaminergic Neural Cells And Pharmaceutical Composition Comprising Dopaminergic Neural Cells For Treatment Of Parkinson's DiseaseS BIOMEDICS·Filed 2019·Application pending·0 cites
- 2438US10067584B2Films for writing and display apparatuses including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Sep 4, 2018·0 cites·18 claims
- 2537US2020064482A1Lidar using negative correlationKOREA ADVANCED INST SCI & TECH·Filed 2019·Application pending·0 cites
- 2636US2004180385A1Method of diagnosing systemic lupus erythematosusFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →