Inventor · disambiguated record
Jongyoun Kim
Also filed as: KIM JONGYOUN
37 granted patents·22 pending applications·40 citations·filing 2017–2025
96Inventor score
Files withSAMSUNG ELECTRONICS CO LTD59
Top patents by PatentIndex Score
59 records- 0197US11373954B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·4 cites·17 claims
- 0296US11437310B2Connection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 6, 2022·3 cites·20 claims
- 0394US10833002B2Connection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 10, 2020·7 cites·20 claims
- 0493US12057435B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0593US11929316B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 12, 2024·2 cites·20 claims
- 0693US11145611B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 12, 2021·3 cites·19 claims
- 0792US11901276B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 13, 2024·1 cites·20 claims
- 0890US11646260B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 9, 2023·2 cites·20 claims
- 0989US12293989B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 6, 2025·1 cites·20 claims
- 1089US10950539B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·5 cites·21 claims
- 1188US11456241B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·18 claims
- 1285US2025364489A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1384US12243813B2Connection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·18 claims
- 1484US11948872B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·1 cites·20 claims
- 1583US12068270B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 20, 2024·1 cites·19 claims
- 1682US12394753B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 19, 2025·0 cites·20 claims
- 1782US10319650B2Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 11, 2019·3 cites·17 claims
- 1881US2025391760A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1980US10741518B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 11, 2020·2 cites·20 claims
- 2080US2025096158A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2179US12230556B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 18, 2025·0 cites·16 claims
- 2279US2024379575A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2378US11810849B2Connection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 7, 2023·0 cites·20 claims
- 2478US2025157910A1Connection structure and method of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2576US11973028B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 30, 2024·0 cites·20 claims
- 2675US2024371811A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2774US12183690B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 2874US12062621B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·18 claims
- 2973US12417972B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 16, 2025·0 cites·20 claims
- 3073US2025112193A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3171US11869835B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 3271US2025239572A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3370US10546829B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jan 28, 2020·1 cites·20 claims
- 3469US11387192B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·0 cites·20 claims
- 3569US2025149418A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3668US11600564B2Redistribution substrate, method of fabricating the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·19 claims
- 3767US11637081B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 25, 2023·0 cites·20 claims
- 3865US11018108B2Method of fabricating semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 25, 2021·0 cites·20 claims
- 3964US2025316635A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4061US12211777B2Semiconductor package including a dummy patternSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 4161US12205914B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 4261US2024421061A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4360US12300625B2Semiconductor package including outer conductive plateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4460US11569157B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·18 claims
- 4558US2024222244A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4657US2024128155A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4755US10685890B2Semiconductor package having redistribution pattern and passivation patterns and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 16, 2020·0 cites·20 claims
- 4855US2024120286A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4954US11508649B2Semiconductor package including substrate with outer insulating layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 5054US2023422521A1Stack-type semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 59 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →