Inventor · disambiguated record
Joongsun Kim
Also filed as: KIM JOONGSUN
1 granted patent·3 pending applications·2 citations·filing 2022–2024
18Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0176US12033961B2Semiconductor package including reinforcement patternSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 9, 2024·2 cites·20 claims
- 0254US2025038094A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0352US2025029935A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0448US2025140676A1Wiring structure, method of manufacturing the wiring structure, and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →