Inventor · disambiguated record
Jonghae Kim
Also filed as: KIM JONGHAE
242 granted patents·107 pending applications·1,353 citations·filing 2004–2025
99Inventor score
Top patents by PatentIndex Score
349 records- 0198US11444068B2Three-dimensional (3D) integrated circuit device having a backside power delivery networkQUALCOMM INC·Filed 2020·Granted Sep 13, 2022·15 cites·10 claims
- 0298US11158590B1Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)QUALCOMM INC·Filed 2020·Granted Oct 26, 2021·12 cites·20 claims
- 0398US9557771B2Electronic device including flexible displaySAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 31, 2017·134 cites·6 claims
- 0498US9449753B2Varying thickness inductorQUALCOMM INC·Filed 2014·Granted Sep 20, 2016·33 cites·25 claims
- 0598US8816567B2Piezoelectric laterally vibrating resonator structure geometries for spurious frequency suppressionZUO CHENGJIE·Filed 2011·Granted Aug 26, 2014·200 cites·24 claims
- 0697US9807882B1Density-optimized module-level inductor ground structureQUALCOMM INC·Filed 2016·Granted Oct 31, 2017·21 cites·20 claims
- 0796US11485114B2Electronic device with coating for protection of windowSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 1, 2022·3 cites·9 claims
- 0896US9502586B1Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2015·Granted Nov 22, 2016·13 cites·18 claims
- 0996US7495519B2System and method for monitoring reliability of a digital systemIBM·Filed 2007·Granted Feb 24, 2009·51 cites·20 claims
- 1095US9893048B2Passive-on-glass (POG) device and methodQUALCOMM INC·Filed 2015·Granted Feb 13, 2018·7 cites·30 claims
- 1195US7418368B2Method and system for testing processor coresIBM·Filed 2007·Granted Aug 26, 2008·31 cites·21 claims
- 1294US11670614B2Integrated circuit assembly with hybrid bondingQUALCOMM INC·Filed 2020·Granted Jun 6, 2023·3 cites·20 claims
- 1394US10433425B1Three-dimensional high quality passive structure with conductive pillar technologyQUALCOMM INC·Filed 2018·Granted Oct 1, 2019·10 cites·16 claims
- 1494US10283257B2Skewed co-spiral inductor structureQUALCOMM INC·Filed 2016·Granted May 7, 2019·12 cites·25 claims
- 1594US10242957B2Compartment shielding in flip-chip (FC) moduleQUALCOMM INC·Filed 2015·Granted Mar 26, 2019·13 cites·30 claims
- 1694US9959964B2Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applicationsQUALCOMM INC·Filed 2015·Granted May 1, 2018·6 cites·25 claims
- 1794US8803648B2Three-dimensional multilayer solenoid transformerLO CHI SHUN·Filed 2012·Granted Aug 12, 2014·16 cites·9 claims
- 1894US7768055B2Passive components in the back end of integrated circuitsIBM·Filed 2005·Granted Aug 3, 2010·28 cites·7 claims
- 1993US12007808B2Foldable electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·3 cites·19 claims
- 2093US10115671B2Incorporation of passives and fine pitch through via for package on packageQUALCOMM MEMS TECHNOLOGIES INC·Filed 2013·Granted Oct 30, 2018·16 cites·34 claims
- 2193US9721946B2Backside coupled symmetric varactor structureQUALCOMM INC·Filed 2016·Granted Aug 1, 2017·7 cites·10 claims
- 2293US9620463B2Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)QUALCOMM INC·Filed 2015·Granted Apr 11, 2017·10 cites·29 claims
- 2393US9101068B2Two-stage power delivery architectureQUALCOMM INC·Filed 2013·Granted Aug 4, 2015·14 cites·8 claims
- 2492US10325855B2Backside drill embedded die substrateQUALCOMM INC·Filed 2016·Granted Jun 18, 2019·10 cites·28 claims
- 2592US9529194B2Head-mounted display apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 27, 2016·15 cites·28 claims
- 2692US9001031B2Complex passive design with special via implementationLO CHI SHUN·Filed 2012·Granted Apr 7, 2015·17 cites·34 claims
- 2792US8384507B2Through via inductor or transformer in a high-resistance substrate with programmabilityQUALCOMM INC·Filed 2010·Granted Feb 26, 2013·12 cites·31 claims
- 2891US11984874B2Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted May 14, 2024·2 cites·33 claims
- 2991US11652101B2Trench capacitor assembly for high capacitance densityQUALCOMM INC·Filed 2021·Granted May 16, 2023·2 cites·12 claims
- 3091US10292269B1Inductor with metal-insulator-metal (MIM) capacitorQUALCOMM INC·Filed 2018·Granted May 14, 2019·9 cites·20 claims
- 3191US9684335B2Rotary device and electronic device having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 20, 2017·15 cites·23 claims
- 3290US9673275B2Isolated complementary metal-oxide semiconductor (CMOS) devices for radio-frequency (RF) circuitsQUALCOMM INC·Filed 2015·Granted Jun 6, 2017·6 cites·18 claims
- 3390US8492874B2High density metal-insulator-metal trench capacitorLAN JE-HSIUNG·Filed 2011·Granted Jul 23, 2013·14 cites·25 claims
- 3490US8037340B2Apparatus and method for micro performance tuning of a clocked digital systemIBM·Filed 2007·Granted Oct 11, 2011·23 cites·23 claims
- 3590US7939910B2Structure for symmetrical capacitorIBM·Filed 2010·Granted May 10, 2011·11 cites·10 claims
- 3690US7518850B2High yield, high density on-chip capacitor designIBM·Filed 2006·Granted Apr 14, 2009·19 cites·5 claims
- 3789US12253885B2Electronic device including flexible displaySAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 18, 2025·2 cites·11 claims
- 3889US9370103B2Low package parasitic inductance using a thru-substrate interposerQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·9 cites·11 claims
- 3989US8518464B2Method and system for manufacturing whole soy milkKIM JONGHAE·Filed 2010·Granted Aug 27, 2013·3 cites·20 claims
- 4089US8143952B2Three dimensional inductor and transformerKIM JONGHAE·Filed 2009·Granted Mar 27, 2012·14 cites·23 claims
- 4188US11336251B2Device with 3D inductor and magnetic core in substrateQUALCOMM INC·Filed 2020·Granted May 17, 2022·2 cites·29 claims
- 4288US9363902B2Three-dimensional multilayer solenoid transformerQUALCOMM MEMS TECHNOLOGIES INC·Filed 2014·Granted Jun 7, 2016·6 cites·7 claims
- 4388US8362599B2Forming radio frequency integrated circuitsQUALCOMM INC·Filed 2009·Granted Jan 29, 2013·26 cites·30 claims
- 4488US7853808B2Independent processor voltage supplyIBM·Filed 2007·Granted Dec 14, 2010·17 cites·20 claims
- 4587US12046530B2Thermal bridge interposer structureQUALCOMM INC·Filed 2021·Granted Jul 23, 2024·1 cites·28 claims
- 4687US11876085B2Package with a substrate comprising an embedded capacitor with side wall couplingQUALCOMM INC·Filed 2021·Granted Jan 16, 2024·2 cites·19 claims
- 4787US10290414B2Substrate comprising an embedded inductor and a thin film magnetic coreQUALCOMM INC·Filed 2015·Granted May 14, 2019·6 cites·20 claims
- 4887US9425761B2High pass filters and low pass filters using through glass via technologyQUALCOMM INC·Filed 2013·Granted Aug 23, 2016·9 cites·21 claims
- 4987US9203373B2Diplexer design using through glass via technologyQUALCOMM INC·Filed 2013·Granted Dec 1, 2015·8 cites·20 claims
- 5087US8350358B2Techniques for placement of active and passive devices within a chipQUALCOMM INC·Filed 2011·Granted Jan 8, 2013·7 cites·18 claims
Showing the top 50 of 349 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →