Inventor · disambiguated record
Jochen Kraft
Also filed as: KRAFT JOCHEN
32 granted patents·5 pending applications·55 citations·filing 2000–2023
94Inventor score
Top patents by PatentIndex Score
37 records- 0193US8378496B2Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connectionAUSTRIAMICROSYSTEMS AG·Filed 2008·Granted Feb 19, 2013·27 cites·17 claims
- 0277US11668636B2Particle density sensor using evanescent wave of waveguideAMS AG·Filed 2018·Granted Jun 6, 2023·2 cites·16 claims
- 0373US10684412B2Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor deviceAMS AG·Filed 2016·Granted Jun 16, 2020·2 cites·16 claims
- 0472US7863170B2Semiconductor body comprising a transistor structure and method for producing a transistor structureAUSTRIAMICROSYSTEMS AG·Filed 2007·Granted Jan 4, 2011·6 cites·27 claims
- 0571US9753218B2Semiconductor device with integrated mirror and method of producing a semiconductor device with integrated mirrorAMS AG·Filed 2014·Granted Sep 5, 2017·3 cites·13 claims
- 0670US8134179B2Photodiode with a reduced dark current and method for the production thereofKRAFT JOCHEN·Filed 2006·Granted Mar 13, 2012·3 cites·9 claims
- 0769US7618871B2Method for the production of a bipolar transistor comprising an improved base terminalAUSTRIAMICROSYSTEMS AG·Filed 2005·Granted Nov 17, 2009·5 cites·14 claims
- 0868US8623762B2Semiconductor device and a method for making the semiconductor deviceKRAFT JOCHEN·Filed 2009·Granted Jan 7, 2014·4 cites·6 claims
- 0959US9768131B2Method of producing a semiconductor device with protruding contactsAMS AG·Filed 2015·Granted Sep 19, 2017·1 cites·5 claims
- 1054US9818724B2Interposer-chip-arrangement for dense packaging of chipsAMS AG·Filed 2014·Granted Nov 14, 2017·0 cites·3 claims
- 1152US10340254B2Method of producing an interposer-chip-arrangement for dense packaging of chipsAMS AG·Filed 2017·Granted Jul 2, 2019·0 cites·6 claims
- 1251US9018726B2Photodiode and production methodKRAFT JOCHEN·Filed 2012·Granted Apr 28, 2015·0 cites·6 claims
- 1350US11808654B2Integrated optical transducer and method for detecting dynamic pressure changesAMS INT AG·Filed 2019·Granted Nov 7, 2023·0 cites·18 claims
- 1450US2025362176A1Sensor module for raman spectroscopy, electronic device and method of conducting raman spectroscopyAMS INT AG·Filed 2023·Application pending·0 cites
- 1548US2022244168A1Photothermal gas detector including an integrated on-chip optical waveguideAMS AG·Filed 2020·Application pending·0 cites
- 1646US11474039B2Chemical sensing device using fluorescent sensing materialAMS AG·Filed 2018·Granted Oct 18, 2022·0 cites·11 claims
- 1746US8969193B2Method of producing a semiconductor device having an interconnect through the substrateAMS AG·Filed 2013·Granted Mar 3, 2015·0 cites·11 claims
- 1845US12211769B2Through-substrate via and method for manufacturing a through-substrate viaAMS AG·Filed 2020·Granted Jan 28, 2025·0 cites·18 claims
- 1945US2022317391A1Bonded structure and method for manufacturing a bonded structureAMS AG·Filed 2020·Application pending·0 cites
- 2044US11764109B2Method of forming a through-substrate via and a semiconductor device comprising a through-substrate viaAMS AG·Filed 2019·Granted Sep 19, 2023·0 cites·11 claims
- 2144US9995894B2Semiconductor device with optical and electrical viasAMS AG·Filed 2014·Granted Jun 12, 2018·0 cites·8 claims
- 2243US2015340264A1Method of application of a carrier to a device waferAMS AG·Filed 2014·Application pending·0 cites
- 2342US8796743B2Light-sensitive componentENICHLMAIR HUBERT·Filed 2006·Granted Aug 5, 2014·0 cites·9 claims
- 2442US8227882B2Light-sensitive component with increased blue sensitivity, method for the production thereof, and operating methodENICHLMAIR HUBERT·Filed 2006·Granted Jul 24, 2012·0 cites·26 claims
- 2541US11367672B2Semiconductor device with through-substrate viaAMS AG·Filed 2019·Granted Jun 21, 2022·0 cites·12 claims
- 2641US9245843B2Semiconductor device with internal substrate contact and method of productionAMS AG·Filed 2013·Granted Jan 26, 2016·0 cites·10 claims
- 2741US8658534B2Method for producing a semiconductor component, and semiconductor componentSCHRANK FRANZ·Filed 2009·Granted Feb 25, 2014·0 cites·11 claims
- 2841US6562547B2Method for producing structure in chipsAUSTRIA MIKROSYSTEME INT·Filed 2000·Granted May 13, 2003·2 cites·7 claims
- 2941US2024230540A1Waveguide sensor window openingAMS OSRAM AG·Filed 2022·Application pending·0 cites
- 3040US10468541B2Semiconductor device with through-substrate via and corresponding method of manufactureAMS AG·Filed 2014·Granted Nov 5, 2019·0 cites·15 claims
- 3139US10243017B2Sensor chip stack and method of producing a sensor chip stackAMS INT AG·Filed 2017·Granted Mar 26, 2019·0 cites·5 claims
- 3238US11355386B2Method for manufacturing a semiconductor device and semiconductor deviceAMS AG·Filed 2018·Granted Jun 7, 2022·0 cites·12 claims
- 3338US9443759B2Method for producing a semiconductor device comprising a conductor layer in the semiconductor body and semiconductor bodyMINIXHOFER RAINER·Filed 2012·Granted Sep 13, 2016·0 cites·11 claims
- 3437US8633107B2Method of producing a semiconductor device and semiconductor device having a through-wafer interconnectKRAFT JOCHEN·Filed 2010·Granted Jan 21, 2014·0 cites·6 claims
- 3535US11127656B2Crack-resistant semiconductor devicesAMS AG·Filed 2018·Granted Sep 21, 2021·0 cites·19 claims
- 3635US8884442B2Method for producing a semiconductor component with a through-contact and semiconductor component with through-contactKRAFT JOCHEN·Filed 2011·Granted Nov 11, 2014·0 cites·4 claims
- 3733US7629628B2Bipolar transistor including a base layer containing carbon atoms and having three distinct layers being doped with a trivalent substanceAUSTRIAMICROSYSTEMS AG·Filed 2002·Granted Dec 8, 2009·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →