Inventor · disambiguated record
Joel Kunz
Also filed as: KUNZ JOEL · KUNZ JOEL AMOS
6 granted patents·6 pending applications·10 citations·filing 2016–2024
75Inventor score
Files withDDP SPECIALTY ELECTRONIC MATERIALS US LLC5DOW GLOBAL TECHNOLOGIES LLC3SIKA TECH AG2DDP SPECIALTY ELECTRONIC MAT US INC1DDP SPECIALTY ELECTRONICS MAT US INC1
Top patents by PatentIndex Score
12 records- 0193US10479916B2Latent two-part polyurethane adhesives curable with infrared radiationDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Nov 19, 2019·4 cites·20 claims
- 0289US10392542B2Latent two-part polyurethane adhesives curable with infrared radiationDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Aug 27, 2019·4 cites·20 claims
- 0387US11814552B2Latent two-part polyurethane adhesivesDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Granted Nov 14, 2023·2 cites·15 claims
- 0485US2024327689A1Polypropylene bonding adhesive and processDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 0582US2024343958A1Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2024·Application pending·0 cites
- 0668US2021122955A1Polypropylene bonding adhesive and processDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Application pending·0 cites
- 0766US10400145B2Latent two-part polyurethane adhesives cured with infrared radiationDOW GLOBAL TECHNOLOGIES LLC·Filed 2016·Granted Sep 3, 2019·0 cites·20 claims
- 0865US2020407611A1Adhesive compositionDDP SPECIALTY ELECTRONIC MAT US INC·Filed 2019·Application pending·0 cites
- 0960US2025162195A1Methods and materials for printing 3-dimensional structures with low density and high compressive strengthSIKA TECH AG·Filed 2022·Application pending·0 cites
- 1059US12134716B2Adhesive compositionDDP SPECIALTY ELECTRONIC MATERIALS US LLC·Filed 2019·Granted Nov 5, 2024·0 cites·12 claims
- 1154US11873421B2Water-based composition with improved transparencySIKA TECH AG·Filed 2020·Granted Jan 16, 2024·0 cites·13 claims
- 1245US2020131414A1Three-component polyurethane adhesive compositionsDDP SPECIALTY ELECTRONICS MAT US INC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →