Inventor · disambiguated record
John Lalena
Also filed as: LALENA JOHN · LALENA JOHN N
0 granted patents·3 pending applications·0 citations·filing 2002–2005
Top patents by PatentIndex Score
3 records- 0140US2005040369A1Thermal interface materials; and compositions comprising indium and zincFiled 2002·Application pending·0 cites
- 0238US2007013054A1Thermally conductive materials, solder preform constructions, assemblies and semiconductor packagesRUCHERT BRIAN D·Filed 2005·Application pending·0 cites
- 0335US2006113683A1Doped alloys for electrical interconnects, methods of production and uses thereofDEAN NANCY·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →