Inventor · disambiguated record
Jong Gi Lee
Also filed as: LEE JONG GI
22 granted patents·12 pending applications·68 citations·filing 1997–2025
92Inventor score
Files withSAMSUNG ELECTRO MECH17SAMSUNG ELECTRONICS CO LTD8LEE JONG GI4AEKYUNG IND CO INC1AEKYUNG IND CO LTD1
Top patents by PatentIndex Score
34 records- 0188US12061316B2Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2020·Granted Aug 13, 2024·2 cites·17 claims
- 0286US8772084B2Multi-chip semiconductor package and method of fabricating the sameLEE JONG-GI·Filed 2012·Granted Jul 8, 2014·9 cites·20 claims
- 0381US2025085511A1Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0479US8254140B2Mounting substrateLEE KWANG-YONG·Filed 2009·Granted Aug 28, 2012·8 cites·17 claims
- 0579US2024231054A1Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0677US8288210B2Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor packageLEE JONG-GI·Filed 2011·Granted Oct 16, 2012·4 cites·13 claims
- 0776US2024361578A1Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 0875US12189092B2Optical imaging system including six lenses of +−−−++, or seven lenses of −−+−++−, +−+−−+ +, −++−+−− or −++−++− refractive powersSAMSUNG ELECTRO MECH·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 0974US2024176111A1Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2024·Application pending·0 cites
- 1071US7612450B2Semiconductor package including dummy board and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 3, 2009·5 cites·21 claims
- 1170US11966015B2Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 23, 2024·0 cites·20 claims
- 1267US11803034B2Optical imaging system including six lenses of +---++, or seven lenses of --+-++-, +-+--++, -++-+-- or -++-++- refractive powersSAMSUNG ELECTRO MECH·Filed 2020·Granted Oct 31, 2023·0 cites·13 claims
- 1366US12228795B2Imaging lens systemSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 18, 2025·0 cites·17 claims
- 1466US11940599B2Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2020·Granted Mar 26, 2024·0 cites·13 claims
- 1564US11782241B2Imaging lens system including eight lenses of ++−+−−+−, ++−+−+−− or ++−+−++− refractive powersSAMSUNG ELECTRO MECH·Filed 2020·Granted Oct 10, 2023·0 cites·16 claims
- 1664US10901184B2Optical imaging systemSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 26, 2021·0 cites·17 claims
- 1764US2025147280A1Imaging lens systemSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 1860US7759795B2Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 20, 2010·2 cites·15 claims
- 1959US12200338B2Lens and lens assembly including the sameSAMSUNG ELECTRO MECH·Filed 2023·Granted Jan 14, 2025·0 cites·16 claims
- 2054US6221371B1Pseudoceramides, and dermatologic external preparations containing the sameAEKYUNG IND CO INC·Filed 1997·Granted Apr 24, 2001·16 cites·8 claims
- 2154US5980870AHerb medicine extract-containing non-bleeding striped dentifrice compositionAEKYUNG IND CO LTD·Filed 1997·Granted Nov 9, 1999·21 cites·5 claims
- 2252US12332548B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 17, 2025·0 cites·16 claims
- 2351US2023072736A1Optical systemSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 2450US8664762B2Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor packageLEE JONG-GI·Filed 2012·Granted Mar 4, 2014·0 cites·9 claims
- 2549US8796597B2In-line package apparatuses and methodsKIM MIN-ILL·Filed 2008·Granted Aug 5, 2014·1 cites·22 claims
- 2648US11640100B2Camera moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted May 2, 2023·0 cites·12 claims
- 2746US2010144137A1Method of interconnecting chips using capillary motionSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2845US2008308913A1Stacked semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2945US2008122081A1Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3045US2009026596A1Lead frame, semiconductor package, and stacked semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3144US10257605B2Earphone protection deviceLEE JONG GI·Filed 2017·Granted Apr 9, 2019·0 cites·5 claims
- 3243US2008290513A1Semiconductor package having molded balls and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3343US2008315379A1Semiconductor packages including thermal stress buffers and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 3435US8283430B2Composition for manufacturing a carboxylic group-containing polymer and a polymer manufactured by using the sameAHN KYO-DUCK·Filed 2008·Granted Oct 9, 2012·0 cites·9 claims
Join the waitlist — get patent alerts
Get an alert when Jong Gi Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →