Inventor · disambiguated record
Joungphil Lee
Also filed as: LEE JOUNGPHIL
6 granted patents·1 pending application·7 citations·filing 2018–2022
72Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD7
Top patents by PatentIndex Score
7 records- 0191US12183653B2Thermal conductive filmSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 31, 2024·2 cites·20 claims
- 0284US11355413B2Adhesive film, semiconductor apparatus using the same, and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 7, 2022·4 cites·22 claims
- 0363US10433469B1Semiconductor package and semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 1, 2019·1 cites·17 claims
- 0460US12062633B2Non-conductive film sheet and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 13, 2024·0 cites·19 claims
- 0550US11876031B2Thermal interface material paste and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 16, 2024·0 cites·18 claims
- 0649US2023187303A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0748US10553546B2Semiconductor package and semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Joungphil Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →