Inventor · disambiguated record
Jong Myeon Lee
Also filed as: LEE JONG M · LEE JONG MYEON
21 granted patents·18 pending applications·99 citations·filing 1999–2019
93Inventor score
Top patents by PatentIndex Score
39 records- 0189US6504287B2Multilayered piezoelectric/electrostrictive ceramic actuatorSAMSUNG ELECTRO MECH·Filed 2001·Granted Jan 7, 2003·34 cites·14 claims
- 0279US11204369B2Semiconductor device test socketMICRO FRIEND CO LTD·Filed 2018·Granted Dec 21, 2021·2 cites·20 claims
- 0379US7473153B2Process for fabricating a field emitter electrode with carbon nanotubesSAMSUNG ELECTRO MECH·Filed 2005·Granted Jan 6, 2009·5 cites·19 claims
- 0478US7438622B2Fabrication method of carbon-fiber web structure type field emitter electrodeSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 21, 2008·4 cites·5 claims
- 0576US8058787B2Carbon-fiber web structure type field emitter electrode and fabrication method of the sameRA SEUNG HYUN·Filed 2008·Granted Nov 15, 2011·7 cites·17 claims
- 0674US7951446B2Constraining green sheet and manufacturing method of multi-layer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Granted May 31, 2011·2 cites·7 claims
- 0771US8557617B2Method of manufacturing light emitting diode packagePARK YOUN GON·Filed 2007·Granted Oct 15, 2013·1 cites·10 claims
- 0871US7425731B2Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2007·Granted Sep 16, 2008·2 cites·13 claims
- 0970US8368097B2Light emitting diode package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 5, 2013·5 cites·4 claims
- 1066US8093172B2Glass composition, dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the sameCHOO HO SUNG·Filed 2008·Granted Jan 10, 2012·3 cites·9 claims
- 1166US7842333B2Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the sameSAMSUNG LED CO LTD·Filed 2006·Granted Nov 30, 2010·2 cites·17 claims
- 1266US6347441B1Manufacturing method of multilayered piezoelectric/electrostrictive ceramic actuatorSAMSUNG ELECTRO MECH·Filed 1999·Granted Feb 19, 2002·28 cites·14 claims
- 1364US7994084B2Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Aug 9, 2011·4 cites·12 claims
- 1453US8178193B2Constraining green sheet and method of manufacturing multi-layer ceramic substrate using the sameCHO BEOM JOON·Filed 2008·Granted May 15, 2012·0 cites·2 claims
- 1552US2012199270A1Method of manufacturing a multi-layer ceramic substrate using a constraining green sheetCHO BEOM JOON·Filed 2012·Application pending·0 cites
- 1651US2010059165A1Method of manufacturing multilayer ceramic substrate having cavitySAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1750US7781155B2Fabrication method of micro-lens and fabrication method of master for micro-lensWON HYONG SIK·Filed 2007·Granted Aug 24, 2010·0 cites·8 claims
- 1850US2009148667A1Method of manufacturing ceramic laminated substrate and ceramic laminated substrate manufactured using the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1949US2009107616A1Manufacturing method of multi-layer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2049US2009117290A1Method of manufacturing non-shrinkage ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2149US2009214881A1Low temperature co-fired ceramic substrate having diffusion barrier layer and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2248US7887905B2Constraining green sheet and manufacturing method of multi-layer ceramic substrate using the sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Feb 15, 2011·0 cites·4 claims
- 2347US8182904B2Laminated ceramic packageCHO BEOM JOON·Filed 2008·Granted May 22, 2012·0 cites·4 claims
- 2446US8226852B2Method of forming phosphor film and method of manufacturing light emitting diode package incorporating the sameLEE HAI SUNG·Filed 2010·Granted Jul 24, 2012·0 cites·10 claims
- 2546US2009114434A1Method of manufacturing non-shrinkage ceramic substrate and non-shrinkage ceramic substrate using the sameSAMSUNG ELECTRO MECHNICS CO LT·Filed 2008·Application pending·0 cites
- 2645US10104767B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 16, 2018·0 cites·16 claims
- 2745US2007212802A1Method for manufacturing light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2844US2022149555A1Contactor block of self-aligning vertical probe card and manufacturing method thereforMICRO FRIEND CO LTD·Filed 2019·Application pending·0 cites
- 2944US2008224160A1High-power light emitting diode and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3043US2009130473A1Carrier film for forming ceramic green sheet and method of fabricating ceramic green sheetCHO BEOM JOON·Filed 2008·Application pending·0 cites
- 3141US8637143B2LTCC composition, LTCC substrate comprising the same and method of manufacturing the sameCHO BEOM JOON·Filed 2011·Granted Jan 28, 2014·0 cites·6 claims
- 3241US2011063174A1Patch antenna and wireless communications moduleSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 3341US2007194691A1Light emitting diode package structure having high light extraction efficiency and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3440US9786573B2Electronic component packageSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 10, 2017·0 cites·11 claims
- 3540US2009133805A1Method of manufacturing multilayer ceramic substrateSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3640US2006052026A1Method of producing field emission type cold-cathode deviceSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
- 3740US2007194341A1Light emitting diode packageSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3840US2006057927A1Fabrication method of field emitter electrodeSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 3932US2016270232A1Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →