Inventor · disambiguated record
Jonggu Lee
Also filed as: LEE JONGGU
5 granted patents·10 pending applications·7 citations·filing 2016–2025
66Inventor score
Top patents by PatentIndex Score
15 records- 0192US11607741B2Semiconductor chip bonding apparatus including head having thermally conductive materialsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 21, 2023·7 cites·20 claims
- 0268US11848301B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 19, 2023·0 cites·20 claims
- 0364US12298676B2Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0464US2025216802A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0562US2023207369A1Wafer chuck table and wafer chuck systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 0660US11626381B2Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 0759US2025054822A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0859US2025107190A1Semiconductor devices including substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0956US2025227995A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1054US2024157181A1Fire suppression system applied to battery pack of electric vehicleMOON YONG TAEK·Filed 2023·Application pending·0 cites
- 1153US2024079264A1Substrate supporting apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1253US2024299787A1Fire suppression system having valve structureYong Taek MOON·Filed 2023·Application pending·0 cites
- 1348US2023191547A1Apparatus and method for controlling chucking forceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1439US2023199754A1Method and apparatus to performing uplink transmission based on configured grant confirmation in wireless communication systemLG ELECTRONICS INC·Filed 2020·Application pending·0 cites
- 1536US10448323B2Node unit of distributed antenna systemSOLID INC·Filed 2016·Granted Oct 15, 2019·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →