Inventor · disambiguated record
Jonggi Lee
Also filed as: LEE JONGGI
8 granted patents·2 pending applications·43 citations·filing 2009–2016
83Inventor score
Top patents by PatentIndex Score
10 records- 0191US8456018B2Semiconductor packagesPARK SANGWOOK·Filed 2011·Granted Jun 4, 2013·23 cites·12 claims
- 0272US8921163B2Semiconductor packages and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 30, 2014·3 cites·13 claims
- 0371US8051555B2Circuit manufacturing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·6 cites·25 claims
- 0469US8420989B2Coil and semiconductor apparatus having the sameKIM MINILL·Filed 2009·Granted Apr 16, 2013·6 cites·4 claims
- 0565US8324522B2Reflow apparatus, reflow method, and package apparatusKIM MINILL·Filed 2009·Granted Dec 4, 2012·3 cites·17 claims
- 0664US9736565B2Protection assembly for ear-mounted sound-output deviceLEE JONGGI·Filed 2016·Granted Aug 15, 2017·2 cites·10 claims
- 0751US8536045B2Reflow methodSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Sep 17, 2013·0 cites·20 claims
- 0847US2012043125A1Circuit boards, methods of forming the same and semiconductor packages including the sameKIM TAEHOON·Filed 2011·Application pending·0 cites
- 0946US2010096754A1Semiconductor package, semiconductor module, and method for fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1041US9530755B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 27, 2016·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →