Inventor · disambiguated record
Jong-Kai Lin
Also filed as: LIN JONG-KAI
12 granted patents·2 pending applications·646 citations·filing 1994–2010
93Inventor score
Top patents by PatentIndex Score
14 records- 0197US7651889B2Electromagnetic shield formation for integrated circuit die packageFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 26, 2010·100 cites·20 claims
- 0297US7648858B2Methods and apparatus for EMI shielding in multi-chip modulesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 19, 2010·59 cites·12 claims
- 0393US6953985B2Wafer level MEMS packagingFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Oct 11, 2005·127 cites·29 claims
- 0489US6310403B1Method of manufacturing components and component thereofMOTOROLA INC·Filed 2000·Granted Oct 30, 2001·60 cites·41 claims
- 0586US5520785AMethod for enhancing aluminum nitrideMOTOROLA INC·Filed 1994·Granted May 28, 1996·65 cites·18 claims
- 0685US5587342AMethod of forming an electrical interconnectMOTOROLA INC·Filed 1995·Granted Dec 24, 1996·93 cites·16 claims
- 0784US6022761AMethod for coupling substrates and structureMOTOROLA INC·Filed 1996·Granted Feb 8, 2000·82 cites·19 claims
- 0883US8097494B2Method of making an integrated circuit package with shielding via ring structureTANG JINBANG·Filed 2010·Granted Jan 17, 2012·6 cites·16 claims
- 0975US5674780AMethod of forming an electrically conductive polymer bump over an aluminum electrodeMOTOROLA INC·Filed 1995·Granted Oct 7, 1997·50 cites·20 claims
- 1068US8004068B2Shielded multi-layer package structuresFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Aug 23, 2011·3 cites·20 claims
- 1161US7869225B2Shielding structures for signal paths in electronic devicesFREESCALE SEMICONDUCTOR INC·Filed 2007·Granted Jan 11, 2011·1 cites·9 claims
- 1253US8385084B2Shielding structures for signal paths in electronic devicesTANG JINBANG·Filed 2010·Granted Feb 26, 2013·0 cites·15 claims
- 1344US2008315376A1Conformal EMI shielding with enhanced reliabilityTANG JINBANG·Filed 2007·Application pending·0 cites
- 1444US2009072357A1Integrated shielding process for precision high density module packagingTANG JINBANG·Filed 2007·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jong-Kai Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →