Inventor · disambiguated record
Joseph T. Lindgren
Also filed as: LINDGREN JOSEPH · LINDGREN JOSEPH T
23 granted patents·5 pending applications·154 citations·filing 2002–2020
95Inventor score
Files withMICRON TECHNOLOGY INC14LINDGREN JOSEPH T6FIRST SOLAR INC4MICRON TECHNOLOGIES INC1ZHU XIAOYUN1
Top patents by PatentIndex Score
28 records- 0187US6710442B1Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·32 cites·58 claims
- 0286US6593221B1Selective passivation of exposed siliconMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 15, 2003·30 cites·36 claims
- 0384US6825564B2Nickel bonding cap over copper metalized bondpadsMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 30, 2004·29 cites·22 claims
- 0472US8592254B2Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devicesLINDGREN JOSEPH T·Filed 2012·Granted Nov 26, 2013·2 cites·20 claims
- 0571US7312164B2Selective passivation of exposed siliconMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 25, 2007·3 cites·37 claims
- 0670US6767817B2Asymmetric platingMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 27, 2004·10 cites·25 claims
- 0769US7052922B2Stable electroless fine pitch interconnect platingMICRON TECHNOLOGY INC·Filed 2003·Granted May 30, 2006·9 cites·33 claims
- 0869US6905953B2Selective passivation of exposed siliconMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 14, 2005·10 cites·41 claims
- 0965US7939949B2Semiconductor device with copper wirebond sites and methods of making sameMICRON TECHNOLOGY INC·Filed 2007·Granted May 10, 2011·2 cites·16 claims
- 1063USD848362SPhotovoltaic deviceFIRST SOLAR INC·Filed 2017·Granted May 14, 2019·7 cites·1 claims
- 1162US8569161B2Semiconductor device with copper wirebond sites and methods of making sameLINDGREN JOSEPH T·Filed 2011·Granted Oct 29, 2013·1 cites·17 claims
- 1261US8291966B2Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devicesLINDGREN JOSEPH T·Filed 2006·Granted Oct 23, 2012·1 cites·19 claims
- 1361US7186636B2Nickel bonding cap over copper metalized bondpadsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 6, 2007·7 cites·17 claims
- 1458US7183133B2Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 27, 2007·5 cites·18 claims
- 1555USD1051853SDual junction box for a photovoltaic deviceFIRST SOLAR INC·Filed 2020·Granted Nov 19, 2024·0 cites·1 claims
- 1655US9054099B2Semiconductor device with copper wirebond sites and methods of making sameMICRON TECHNOLOGY INC·Filed 2013·Granted Jun 9, 2015·0 cites·15 claims
- 1754US2004238952A1Asymmetric platingFiled 2004·Application pending·0 cites
- 1851US8431484B2Stable electroless fine pitch interconnect platingLINDGREN JOSEPH T·Filed 2011·Granted Apr 30, 2013·0 cites·14 claims
- 1951US7256115B2Asymmetric platingMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 14, 2007·2 cites·30 claims
- 2050US2007170551A1Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatingsLINDGREN JOSEPH T·Filed 2007·Application pending·0 cites
- 2150US2006180461A1Stable electroless fine pitch interconnect platingLINDGREN JOSEPH T·Filed 2006·Application pending·0 cites
- 2249US7485565B2Nickel bonding cap over copper metalized bondpadsMICRON TECHNOLOGIES INC·Filed 2006·Granted Feb 3, 2009·0 cites·20 claims
- 2344USD943507SPhotovoltaic deviceFIRST SOLAR INC·Filed 2019·Granted Feb 15, 2022·2 cites·1 claims
- 2444US2004026256A1Method and apparatus for protecting tooling in a lead-free bathFiled 2002·Application pending·0 cites
- 2543USD944724SPhotovoltaic deviceFIRST SOLAR INC·Filed 2019·Granted Mar 1, 2022·2 cites·1 claims
- 2642US7190052B2Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor materialMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 13, 2007·0 cites·20 claims
- 2741US7067924B2Nickel bonding cap over copper metalized bondpadsMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 27, 2006·0 cites·17 claims
- 2836US2012315754A1Interconnection barrier material device and methodZHU XIAOYUN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →