Inventor · disambiguated record
Joseph Liu
Also filed as: LIU JOSEPH · LIU JOSEPH O
7 granted patents·6 pending applications·2 citations·filing 2018–2025
72Inventor score
Files withTEXAS INSTRUMENTS INC13
Top patents by PatentIndex Score
13 records- 0190US11380637B2Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2020·Granted Jul 5, 2022·2 cites·23 claims
- 0279US2025029943A1Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0379US2025372454A1Efficient removal of street test devices during wafer dicingTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0473US12142586B2Efficient redistribution layer topologyTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 12, 2024·0 cites·22 claims
- 0567US2023260839A1Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0665US12394671B2Efficient removal of street test devices during wafer dicingTEXAS INSTRUMENTS INC·Filed 2022·Granted Aug 19, 2025·0 cites·15 claims
- 0757US12512416B2Laser ablation for die separation to reduce laser splash and electronic deviceTEXAS INSTRUMENTS INC·Filed 2022·Granted Dec 30, 2025·0 cites·24 claims
- 0857US11854922B2Semicondutor package substrate with die cavity and redistribution layerTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·24 claims
- 0955US11664276B2Front side laser-based wafer dicingTEXAS INSTRUMENTS INC·Filed 2018·Granted May 30, 2023·0 cites·18 claims
- 1054US2024332078A1Post-laser dicing wafer-level testingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1149US2025006501A1Pre-wafer fabrication laser dicingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1247US12255097B2Splash resistant laser wafer singulation by crack length controlTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 18, 2025·0 cites·21 claims
- 1344US2023253251A1Singulating semiconductor wafersTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →