Inventor · disambiguated record
John Mackay
Also filed as: MACKAY JOHN · MACKAY JOHN T
13 granted patents·4 pending applications·243 citations·filing 1984–2011
93Inventor score
Top patents by PatentIndex Score
17 records- 0182US7654432B2Forming solder balls on substratesWSTP LLC·Filed 2008·Granted Feb 2, 2010·7 cites·11 claims
- 0281US7604153B2Forming solder balls on substratesWSTP LLC·Filed 2006·Granted Oct 20, 2009·11 cites·11 claims
- 0379US7837083B2Forming solder balls on substratesWSTP LLC·Filed 2009·Granted Nov 23, 2010·5 cites·11 claims
- 0479US6609652B2Ball bumping substrates, particuarly wafersSPHERETEK LLC·Filed 2001·Granted Aug 26, 2003·28 cites·11 claims
- 0579US6293456B1Methods for forming solder balls on substratesSPHERETEK LLC·Filed 1999·Granted Sep 25, 2001·47 cites·21 claims
- 0678US6126059ACaptured-cell solder printing and reflow methods and apparatusesFUJITSU LTD·Filed 1999·Granted Oct 3, 2000·39 cites·19 claims
- 0778US5988487ACaptured-cell solder printing and reflow methodsFUJITSU LTD·Filed 1997·Granted Nov 23, 1999·40 cites·17 claims
- 0871US7007833B2Forming solder balls on substratesMACKAY JOHN·Filed 2003·Granted Mar 7, 2006·17 cites·7 claims
- 0971US4577398AMethod for mounting a semiconductor chipTRILOGY COMPUTER DEV PARTNERS·Filed 1984·Granted Mar 25, 1986·35 cites·35 claims
- 1068US7842599B2Bumping electronic components using transfer substratesWSTP LLC·Filed 2007·Granted Nov 30, 2010·3 cites·5 claims
- 1166US7819301B2Bumping electronic components using transfer substratesWSTP LLC·Filed 2007·Granted Oct 26, 2010·3 cites·11 claims
- 1261US8446319B2Electronic tracking systemPARKER EVAN·Filed 2011·Granted May 21, 2013·5 cites·11 claims
- 1349US2011092066A1Bumping Electronic Components Using Transfer SubstratesMACKAY JOHN·Filed 2010·Application pending·0 cites
- 1448US7288471B2Bumping electronic components using transfer substratesMACKAY JOHN·Filed 2004·Granted Oct 30, 2007·3 cites·14 claims
- 1543US2010029074A1Maskless Process for Solder Bump ProductionMACKAY JOHN·Filed 2009·Application pending·0 cites
- 1643US2009298277A1Maskless Process for Solder Bumps ProductionMACKAY JOHN·Filed 2009·Application pending·0 cites
- 1739US2004069840A1Method and apparatus for filling a mask with solder pasteFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →