Inventor · disambiguated record
Joseph F. Maniscalco
Also filed as: MANISCALCO JOSEPH · MANISCALCO JOSEPH F · MANISCALCO JOSEPH FRANCIS
30 granted patents·5 pending applications·120 citations·filing 1997–2021
94Inventor score
Top patents by PatentIndex Score
35 records- 0197US10529622B1Void-free metallic interconnect structures with self-formed diffusion barrier layersIBM·Filed 2018·Granted Jan 7, 2020·16 cites·20 claims
- 0293US11758819B2Magneto-resistive random access memory with laterally-recessed free layerIBM·Filed 2020·Granted Sep 12, 2023·2 cites·8 claims
- 0391US10049980B1Low resistance seed enhancement spacers for voidless interconnect structuresIBM·Filed 2017·Granted Aug 14, 2018·7 cites·16 claims
- 0487US11183455B2Interconnects with enlarged contact areaIBM·Filed 2020·Granted Nov 23, 2021·2 cites·7 claims
- 0583US11430690B2Interconnects having air gap spacersIBM·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
- 0679US10950493B1Interconnects having air gap spacersIBM·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 0778US10741748B2Back end of line metallization structuresIBM·Filed 2018·Granted Aug 11, 2020·2 cites·6 claims
- 0876US5896869ASemiconductor package having etched-back silver-copper brazeIBM·Filed 1997·Granted Apr 27, 1999·51 cites·11 claims
- 0972US10686126B2Back end of line metallization structuresIBM·Filed 2019·Granted Jun 16, 2020·1 cites·9 claims
- 1069US11069566B2Hybrid sidewall barrier facilitating low resistance interconnectionIBM·Filed 2018·Granted Jul 20, 2021·1 cites·6 claims
- 1168US12040230B2Encapsulated top via interconnectsIBM·Filed 2021·Granted Jul 16, 2024·0 cites·12 claims
- 1268US6124074APhotoresist compositions with cyclic olefin polymers and hydrophobic non-steroidal multi-alicyclic additivesIBM·Filed 1999·Granted Sep 26, 2000·29 cites·15 claims
- 1363US6562554B1Photoresist compositions with cyclic olefin polymers and hydrophobic non-steroidal multi-alicyclic additivesIBM·Filed 2000·Granted May 13, 2003·6 cites·9 claims
- 1461US12349597B2Conical magnetic random access memory pillar structuresIBM·Filed 2021·Granted Jul 1, 2025·0 cites·25 claims
- 1561US11682471B2Dual damascene crossbar array for disabling a defective resistive switching device in the arrayIBM·Filed 2020·Granted Jun 20, 2023·0 cites·14 claims
- 1660US12108685B2Multi-diameter magnetic random-access memory pillar structureIBM·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 1758US11177171B2Encapsulated top via interconnectsIBM·Filed 2019·Granted Nov 16, 2021·0 cites·9 claims
- 1858US10930589B2Advanced interconnects containing an IMT linerIBM·Filed 2019·Granted Feb 23, 2021·0 cites·18 claims
- 1957US12342726B2Etching of magnetic tunnel junction (MTJ) stack for magnetoresistive random-access memory (MRAM)IBM·Filed 2021·Granted Jun 24, 2025·0 cites·7 claims
- 2056US10903116B2Void-free metallic interconnect structures with self-formed diffusion barrier layersIBM·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 2156US10468346B2Advanced interconnects containing an IMT linerIBM·Filed 2018·Granted Nov 5, 2019·0 cites·18 claims
- 2255US12167700B2Replacement bottom electrode structure for MRAM devicesIBM·Filed 2021·Granted Dec 10, 2024·0 cites·18 claims
- 2354US10431542B2Low resistance seed enhancement spacers for voidless interconnect structuresIBM·Filed 2017·Granted Oct 1, 2019·0 cites·13 claims
- 2453US11380641B2Pillar bump with noble metal seed layer for advanced heterogeneous integrationIBM·Filed 2020·Granted Jul 5, 2022·0 cites·12 claims
- 2552US11664271B2Dual damascene with short linerIBM·Filed 2019·Granted May 30, 2023·0 cites·14 claims
- 2652US2014216342A1Processing system for combined metal deposition and reflow anneal for forming interconnect structuresIBM·Filed 2013·Application pending·0 cites
- 2751US2014220777A1Processing system for combined metal deposition and reflow anneal for forming interconnect structuresIBM·Filed 2013·Application pending·0 cites
- 2851US2023187343A1Top via interconnect structure with texture suppression layersIBM·Filed 2021·Application pending·0 cites
- 2950US11158538B2Interconnect structures with cobalt-infused ruthenium liner and a cobalt capIBM·Filed 2020·Granted Oct 26, 2021·0 cites·4 claims
- 3049US2012237902A1Techniques for providing custom-formed implantsMANISCALCO JOSEPH·Filed 2012·Application pending·0 cites
- 3148US12317752B2MRAM structure with multilayer encapsulationIBM·Filed 2021·Granted May 27, 2025·0 cites·24 claims
- 3248US11282768B2Fully-aligned top-via structures with top-via trimIBM·Filed 2019·Granted Mar 22, 2022·0 cites·17 claims
- 3348US10546815B2Low resistance interconnect structure with partial seed enhancement linerIBM·Filed 2018·Granted Jan 28, 2020·0 cites·18 claims
- 3448US2023137421A1Mram bottom electrode shroudIBM·Filed 2021·Application pending·0 cites
- 3544US10840325B2Low resistance metal-insulator-metal capacitor electrodeIBM·Filed 2018·Granted Nov 17, 2020·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →