Inventor · disambiguated record
John E. Mcconnell
Also filed as: MCCONNELL JOHN · MCCONNELL JOHN E · MCCONNELL JOHN ERIC
44 granted patents·6 pending applications·892 citations·filing 1977–2022
98Inventor score
Files withKEMET ELECTRONICS CORP24LEAR CORP12MCCONNELL JOHN E5LEAR AUTOMOTIVE DEARBORN INC3BULTITUDE JOHN2
Top patents by PatentIndex Score
50 records- 0198US6608399B2Vehicle universal docking station and electronic feature modulesLEAR CORP·Filed 2001·Granted Aug 19, 2003·289 cites·16 claims
- 0297US6423918B1Dome switchLEAR CORP·Filed 2000·Granted Jul 23, 2002·103 cites·13 claims
- 0396US10707145B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jul 7, 2020·24 cites·44 claims
- 0495US9793057B2Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bondKEMET ELECTRONICS CORP·Filed 2016·Granted Oct 17, 2017·12 cites·20 claims
- 0593US8988857B2High aspect ratio stacked MLCC designMCCONNELL JOHN E·Filed 2011·Granted Mar 24, 2015·22 cites·77 claims
- 0693US7071434B1Button and light pipe mechanism and assemblyLEAR CORP·Filed 2005·Granted Jul 4, 2006·27 cites·20 claims
- 0792US9779874B2Sintering of high temperature conductive and resistive pastes onto temperature sensitive and atmospheric sensitive materialsMCCONNELL JOHN E·Filed 2012·Granted Oct 3, 2017·9 cites·25 claims
- 0892US9748043B2Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitorsKEMET ELECTRONICS CORP·Filed 2013·Granted Aug 29, 2017·9 cites·46 claims
- 0992US9472342B2Leadless multi-layered ceramic capacitor stacksKEMET ELECTRONICS CORP·Filed 2013·Granted Oct 18, 2016·13 cites·28 claims
- 1092US9171672B2Stacked leaded arrayMCCONNELL JOHN E·Filed 2012·Granted Oct 27, 2015·19 cites·14 claims
- 1192US9025311B1Very large ceramic capacitor with mechanical shock resistanceKEMET ELECTRONICS CORP·Filed 2013·Granted May 5, 2015·10 cites·20 claims
- 1292US8896986B2Method of improving electromechanical integrity of cathode coating to cathode termination interfaces in solid electrolytic capacitorsCHACKO ANTONY P·Filed 2011·Granted Nov 25, 2014·11 cites·22 claims
- 1391US9805872B2Multiple MLCC modulesKEMET ELECTRONICS CORP·Filed 2015·Granted Oct 31, 2017·5 cites·38 claims
- 1491US8902565B2Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastesMCCONNELL JOHN E·Filed 2011·Granted Dec 2, 2014·19 cites·18 claims
- 1591US7098411B1Electronic module for universal garage door opener and assembly methodLEAR CORP·Filed 2005·Granted Aug 29, 2006·24 cites·16 claims
- 1689US8264816B2Externally fused and resistively loaded safety capacitorBULTITUDE JOHN·Filed 2009·Granted Sep 11, 2012·15 cites·40 claims
- 1788US8331078B2Leaded multi-layer ceramic capacitor with low ESL and low ESRMCCONNELL JOHN E·Filed 2010·Granted Dec 11, 2012·12 cites·30 claims
- 1886US10381162B2Leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2017·Granted Aug 13, 2019·5 cites·32 claims
- 1985US6433728B1Integrally molded remote entry transmitterLEAR AUTOMOTIVE DEARBORN INC·Filed 1999·Granted Aug 13, 2002·49 cites·3 claims
- 2082US10681814B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2017·Granted Jun 9, 2020·3 cites·60 claims
- 2182US8904609B2Externally fused and resistively loaded safety capacitorBULTITUDE JOHN·Filed 2011·Granted Dec 9, 2014·6 cites·2 claims
- 2281US7458627B2Visor assembly incorporating an electronic control moduleLEAR CORP·Filed 2007·Granted Dec 2, 2008·9 cites·20 claims
- 2377US10068707B2Leadless multi-layered ceramic capacitor stacksKEMET ELECTRONICS CORP·Filed 2015·Granted Sep 4, 2018·2 cites·32 claims
- 2477US8104780B1Adult activity chairMCCONNELL-COPPLOE JEAN·Filed 2009·Granted Jan 31, 2012·16 cites·6 claims
- 2577US7760071B2Appliance remote control having separated user control and transmitter modules remotely located from and directly connected to one anotherLEAR CORP·Filed 2006·Granted Jul 20, 2010·6 cites·9 claims
- 2677US7256363B1Intermediate switch actuator arrayLEAR CORP·Filed 2006·Granted Aug 14, 2007·9 cites·20 claims
- 2776US9881744B2Electronic component termination and assembly by means of transient liquid phase sintering metalurgical bondsKEMET ELECTRONICS CORP·Filed 2014·Granted Jan 30, 2018·3 cites·36 claims
- 2875US7218745B2Headliner transducer coversLEAR CORP·Filed 2002·Granted May 15, 2007·24 cites·8 claims
- 2973US11432448B2Method of forming an electronic deviceKEMET ELECTRONICS CORP·Filed 2020·Granted Aug 30, 2022·0 cites·30 claims
- 3073US7958627B2Method of attaching an electronic device to an MLCC having a curved surfaceKEMET ELECTRONICS CORP·Filed 2008·Granted Jun 14, 2011·5 cites·14 claims
- 3172US6181025B1Integral interrogator-coil circuitLEAR CORP·Filed 1999·Granted Jan 30, 2001·29 cites·15 claims
- 3271US10984955B2Electronic component structures with reduced microphonic noiseKEMET ELECTRONICS CORP·Filed 2019·Granted Apr 20, 2021·1 cites·37 claims
- 3367US10366836B2Electronic component structures with reduced microphonic noiseKEMET ELECTRONICS CORP·Filed 2016·Granted Jul 30, 2019·1 cites·30 claims
- 3466US6016676AUniversal fobLEAR AUTOMOTIVE DEARBORN INC·Filed 1998·Granted Jan 25, 2000·91 cites·4 claims
- 3559US10729051B2Component stability structureKEMET ELECTRONICS CORP·Filed 2016·Granted Jul 28, 2020·0 cites·27 claims
- 3659US8910356B2Method of attaching an electronic device to an MLCC having a curved surfaceRANDALL MICHAEL S·Filed 2010·Granted Dec 16, 2014·1 cites·6 claims
- 3759US2014139971A1Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive MaterialsKEMET ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 3858US10229785B2Multi-layered ceramic capacitor with soft leaded moduleKEMET ELECTRONICS CORP·Filed 2013·Granted Mar 12, 2019·0 cites·48 claims
- 3957US10790094B2Method of forming a leadless stack comprising multiple componentsKEMET ELECTRONICS CORP·Filed 2019·Granted Sep 29, 2020·0 cites·10 claims
- 4056US11227719B2Leadless multi-layered ceramic capacitor stackKEMET ELECTRONICS CORP·Filed 2018·Granted Jan 18, 2022·0 cites·20 claims
- 4153US10757810B2High density multi-component packagesKEMET ELECTRONICS CORP·Filed 2018·Granted Aug 25, 2020·0 cites·60 claims
- 4253US2023038175A1Stable Power Modules By Thermoelectric CoolingKEMET ELECTRONICS CORP·Filed 2022·Application pending·0 cites
- 4351US9357634B2Coefficient of thermal expansion compensating compliant componentKEMET ELECTRONICS CORP·Filed 2013·Granted May 31, 2016·0 cites·72 claims
- 4450US4065740AElectrical coil assemblyGEN MOTORS CORP·Filed 1977·Granted Dec 27, 1977·9 cites·6 claims
- 4546US7357647B1Assembly for controlling a deviceLEAR CORP·Filed 2007·Granted Apr 15, 2008·0 cites·20 claims
- 4643US2018368293A1Stable Power Capacitors by Thermoelectric CoolingKEMET ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 4742US2002154050A1Integrally molded remote entry transmitterLEAR AUTOMOTIVE DEARBORN INC·Filed 2002·Application pending·0 cites
- 4840US10224149B2Bulk MLCC capacitor moduleKEMET ELECTRONICS CORP·Filed 2016·Granted Mar 5, 2019·0 cites·55 claims
- 4938US2007134944A1Conductive composite distribution system for a vehicleLEAR CORP·Filed 2005·Application pending·0 cites
- 5037US2007205950A1Antenna assembley for use in wireless communicationLEAR CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →