Inventor · disambiguated record
John R. Mccormick
Also filed as: MCCORMICK JOHN · MCCORMICK JOHN R
3 granted patents·9 pending applications·7 citations·filing 2003–2024
56Inventor score
Files withROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC7DUPONT ELECTRONIC MAT HOLDING INC2MCCORMICK JOHN2
Top patents by PatentIndex Score
12 records- 0175US2023166381A1Cmp polishing pad with polishing elements on supportsROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2023·Application pending·0 cites
- 0265US2021299816A1Cmp polishing pad with protruding structures having engineered open void spaceROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2020·Application pending·0 cites
- 0365US2024181596A1Micro-layer cmp polishing subpadROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2023·Application pending·0 cites
- 0464US2023311269A1Cmp polishing pad with protruding structures having engineered open void spaceROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2023·Application pending·0 cites
- 0563US2024181597A1Dual-layer cmp polishing subpadROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2023·Application pending·0 cites
- 0663US2010065617A1Gift wrapping envelopeMCCORMICK JOHN·Filed 2009·Application pending·0 cites
- 0760US2025178156A1Chemical Mechanical Polishing PadDUPONT ELECTRONIC MAT HOLDING INC·Filed 2024·Application pending·0 cites
- 0860US2025178155A1Chemical Mechanical Polishing PadDUPONT ELECTRONIC MAT HOLDING INC·Filed 2024·Application pending·0 cites
- 0957US11833638B2CMP polishing pad with polishing elements on supportsROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2020·Granted Dec 5, 2023·0 cites·4 claims
- 1054US2007046441A1Gift-wrapping envelopeMCCORMICK JOHN·Filed 2005·Application pending·0 cites
- 1149US11524385B2CMP polishing pad with lobed protruding structuresROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC·Filed 2019·Granted Dec 13, 2022·0 cites·10 claims
- 1238USD497542SGift wrapping envelopeFiled 2003·Granted Oct 26, 2004·7 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →