Inventor · disambiguated record
John F. Mcmahon
Also filed as: MCMAHON JOHN F · MCMAHON JOHN FRANCIS
26 granted patents·1,413 citations·filing 1976–2001
97Inventor score
Top patents by PatentIndex Score
26 records- 0198US5734555AShared socket multi-chip module and/or piggyback pin grid array packageINTEL CORP·Filed 1994·Granted Mar 31, 1998·219 cites·11 claims
- 0297USD256816SToy gliderCPG PROD CORP·Filed 1978·Granted Sep 9, 1980·63 cites·1 claims
- 0395US6890798B2Stacked chip packagingINTEL CORP·Filed 2001·Granted May 10, 2005·123 cites·11 claims
- 0492US5804771AOrganic substrate (PCB) slip plane "stress deflector" for flip chip deivcesINTEL CORP·Filed 1996·Granted Sep 8, 1998·111 cites·9 claims
- 0592US5375041ARa-tab array bump tab tape based I.C. packageINTEL CORP·Filed 1992·Granted Dec 20, 1994·118 cites·10 claims
- 0692US5321583AElectrically conductive interposer and array package concept for interconnecting to a circuit boardINTEL CORP·Filed 1992·Granted Jun 14, 1994·86 cites·13 claims
- 0791US5362656AMethod of making an electronic assembly having a flexible circuit wrapped around a substrateINTEL CORP·Filed 1994·Granted Nov 8, 1994·108 cites·8 claims
- 0890US6075712AFlip-chip having electrical contact pads on the backside of the chipINTEL CORP·Filed 1999·Granted Jun 13, 2000·113 cites·22 claims
- 0982US5307240AChiplid, multichip semiconductor package design conceptINTEL CORP·Filed 1992·Granted Apr 26, 1994·69 cites·5 claims
- 1081US5777345AMulti-chip integrated circuit packageINTEL CORP·Filed 1996·Granted Jul 7, 1998·87 cites·17 claims
- 1177US5892275AHigh performance power and ground edge connect IC packageINTEL CORP·Filed 1997·Granted Apr 6, 1999·52 cites·6 claims
- 1276US5497938ATape with solder forms and methods for transferring solder to chip assembliesINTEL CORP·Filed 1994·Granted Mar 12, 1996·46 cites·19 claims
- 1373US5662262ATape withh solder forms and methods for transferring solder forms to chip assembliesINTEL CORP·Filed 1995·Granted Sep 2, 1997·32 cites·10 claims
- 1471US5903432AComputer package with a polygonal shaped motherboardINTEL CORPORTATION·Filed 1997·Granted May 11, 1999·52 cites·8 claims
- 1568US5808875AIntegrated circuit solder-rack interconnect moduleINTEL CORP·Filed 1997·Granted Sep 15, 1998·37 cites·11 claims
- 1661US5671121AKangaroo multi-package interconnection conceptINTEL CORP·Filed 1996·Granted Sep 23, 1997·26 cites·25 claims
- 1756USD244954SToy wheeled figureGEN MILLS FUN GROUP INC·Filed 1976·Granted Jul 5, 1977·5 cites·1 claims
- 1852US5811880ADesign for mounting discrete components inside an integrated circuit package for frequency governing of microprocessorsINTEL CORP·Filed 1997·Granted Sep 22, 1998·20 cites·8 claims
- 1952US5476401ACompact water jet propulsion system for a marine vehicleUS ARMY·Filed 1994·Granted Dec 19, 1995·16 cites·23 claims
- 2051USD244953SToy wheeled figureGEN MILLS FUN GROUP INC·Filed 1976·Granted Jul 5, 1977·4 cites·1 claims
- 2145US6208527B1Retention mechanism assembly for processor cartridges with captured screw fastenersINTEL CORP·Filed 1998·Granted Mar 27, 2001·17 cites·23 claims
- 2242USD244952SToy wheeled figureGEN MILLS FUN GROUP INC·Filed 1976·Granted Jul 5, 1977·2 cites·1 claims
- 2337US6173489B1Organic substrate (PCB) slip plane “stress deflector” for flip chip devicesINTEL CORP·Filed 1998·Granted Jan 16, 2001·5 cites·27 claims
- 2436USD244951SToy wheeled figureGEN MILLS FUN GROUP INC·Filed 1976·Granted Jul 5, 1977·1 cites·1 claims
- 2536USD244955SToy wheeled figureGEN MILLS FUN GROUP INC·Filed 1976·Granted Jul 5, 1977·1 cites·1 claims
- 2632USD244950SToy wheeled figureGEN MILLS FUN GROUP INC·Filed 1976·Granted Jul 5, 1977·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →