Inventor · disambiguated record
Joel Medina
Also filed as: MEDINA JOEL · MEDINA JOEL T · MEDINA JOEL TOMAS
4 granted patents·3 pending applications·40 citations·filing 2003–2023
74Inventor score
Top patents by PatentIndex Score
7 records- 0180US7550856B2Grooved substrates for uniform underfilling solder ball assembled electronic devicesTEXAS INSTRUMENTS INC·Filed 2006·Granted Jun 23, 2009·10 cites·8 claims
- 0269US7033864B2Grooved substrates for uniform underfilling solder ball assembled electronic devicesTEXAS INSTRUMENTS INC·Filed 2004·Granted Apr 25, 2006·16 cites·11 claims
- 0361US2025003105A1Electroplating systems and methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0459US6969638B2Low cost substrate for an integrated circuit device with bondpads free of plated goldTEXAS INSTRUMENTS INC·Filed 2003·Granted Nov 29, 2005·14 cites·17 claims
- 0537US2006097400A1Substrate via pad structure providing reliable connectivity in array package devicesTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 0634US10797010B2Semiconductor package having a metal barrierTEXAS INSTRUMENTS INC·Filed 2017·Granted Oct 6, 2020·0 cites·19 claims
- 0734US2006024974A1Surface treatment for oxidation removal in integrated circuit package assembliesTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →