Inventor · disambiguated record
Jordan Mizerak
Also filed as: MIZERAK JORDAN
12 granted patents·7 pending applications·47 citations·filing 2017–2024
88Inventor score
Top patents by PatentIndex Score
19 records- 0196US11277937B2Re-entrant flow cold plateJETCOOL TECH INC·Filed 2020·Granted Mar 15, 2022·10 cites·19 claims
- 0296US11191184B2Direct contact fluid based cooling moduleJETCOOL TECH INC·Filed 2020·Granted Nov 30, 2021·11 cites·24 claims
- 0394US11844193B2Direct contact fluid based cooling moduleJETCOOL TECH INC·Filed 2021·Granted Dec 12, 2023·3 cites·24 claims
- 0493US12016157B2Actively cooled heat-dissipation lids for computer processors and assembliesJETCOOL TECH INC·Filed 2023·Granted Jun 18, 2024·2 cites·6 claims
- 0592US12289861B2Liquid-in-liquid cooling system for electronic componentsJETCOOL TECH INC·Filed 2022·Granted Apr 29, 2025·2 cites·24 claims
- 0691US12048118B2Flow-through, hot-spot-targeting immersion cooling assemblyJETCOOL TECH INC·Filed 2022·Granted Jul 23, 2024·2 cites·20 claims
- 0790US10746475B2Multi-phase thermal control apparatus, evaporators and methods of manufacture thereofCALIFORNIA INST OF TECHN·Filed 2017·Granted Aug 18, 2020·15 cites·20 claims
- 0881US11963341B2High temperature electronic device thermal management systemJETCOOL TECH INC·Filed 2021·Granted Apr 16, 2024·1 cites·22 claims
- 0978US12324126B2Actively cooled heat-dissipation lids for computer processors and processor assembliesJETCOOL TECH INC·Filed 2024·Granted Jun 3, 2025·0 cites·19 claims
- 1078US12100643B2Thermal management of electronics using co-located microjet nozzles and electronic elementsJETCOOL TECH INC·Filed 2020·Granted Sep 24, 2024·1 cites·10 claims
- 1175US2025056759A1Direct Contact Fluid Based Cooling ModuleJETCOOL TECH INC·Filed 2024·Application pending·0 cites
- 1267US2022408592A1Re-Entrant Flow Cold PlateJETCOOL TECH INC·Filed 2022·Application pending·0 cites
- 1361US12289871B2High temperature electronic device thermal management systemJETCOOL TECH INC·Filed 2023·Granted Apr 29, 2025·0 cites·21 claims
- 1454US2020378687A1Multi-Phase Thermal Control Apparatus, Evaporators and Methods of Manufacture ThereofCALIFORNIA INST OF TECHN·Filed 2020·Application pending·0 cites
- 1553US2023284416A1Ship-and-Install Electronics Assembly with Multifunctional Interface Chassis and Liquid-Fluid Heat ExchangeJETCOOL TECH INC·Filed 2023·Application pending·0 cites
- 1647US2022117115A1Multi-Material, Variable Heat Flux Cold PlateJETCOOL TECH INC·Filed 2021·Application pending·0 cites
- 1744US2020350233A1Microjet-Cooled Flanges for Electronic DevicesJETCOOL TECH INC·Filed 2020·Application pending·0 cites
- 1843US12288733B2Conformal cooling assembly with substrate fluid-proofing for multi-die electronic assembliesJETCOOL TECH INC·Filed 2022·Granted Apr 29, 2025·0 cites·27 claims
- 1941US2020326025A1Fluid-Pressure Assisted Coaxial Fluid Elements, Fittings and AssembliesJETCOOL TECH INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →