Inventor · disambiguated record
John Carlo Cruz Molina
Also filed as: MOLINA JOHN CARLO · MOLINA JOHN CARLO C · MOLINA JOHN CARLO CRUZ
8 granted patents·22 pending applications·1 citations·filing 2018–2024
74Inventor score
Files withTEXAS INSTRUMENTS INC30
Top patents by PatentIndex Score
30 records- 0179US11637083B2Flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 25, 2023·1 cites·18 claims
- 0273US12512381B2Plated walls defining mold compound cavitiesTEXAS INSTRUMENTS INC·Filed 2024·Granted Dec 30, 2025·0 cites·19 claims
- 0370US12266631B2Flip-chip package assemblyTEXAS INSTRUMENTS INC·Filed 2023·Granted Apr 1, 2025·0 cites·15 claims
- 0462US11942387B2Plated walls defining mold compound cavitiesTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 26, 2024·0 cites·15 claims
- 0560US12266624B2Semiconductor die with solder restraining wallTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 1, 2025·0 cites·22 claims
- 0660US11862479B2MCM package isolation through leadframe design and package saw processTEXAS INSTRUMENTS INC·Filed 2021·Granted Jan 2, 2024·0 cites·21 claims
- 0757US2025372472A1Topside cooling band for multiple electronic componentsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0855US2025105195A1Electronic component package having a metal plate structure that includes a tapered foot portionTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0954US11929308B2Flip chip package assemblyTEXAS INSTRUMENTS INC·Filed 2021·Granted Mar 12, 2024·0 cites·24 claims
- 1053US2025373226A1Bulk acoustic wave cavity isolation from die attach material outgassingTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1152US2024203919A1Integrated circuit having exposed leadsTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1251US2025183124A1Microelectronic package with raised connector for external componentTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1350US11081366B2MCM package isolation through leadframe design and package saw processTEXAS INSTRUMENTS INC·Filed 2018·Granted Aug 3, 2021·0 cites·20 claims
- 1450US2025301672A1Integrated magnetic component in electronic apparatusTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1550US2025079273A1Back side mold compound flash supression trench for exposed die packagingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1649US2024105557A1No-lead integrated circuit having an ablated mold compound and extruded contactsTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 1749US2025006683A1Bump landing with bond wires for improved solder wettingTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1849US2025079282A1Packages with notched, interdigitated, and retracted metal layersTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1949US2025079388A1Integrated circuit having improved ball bonding adhesionTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2048US2025174525A1Recessed clip pad for passive surface mount componentTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2148US2025006607A1Semiconductor package with retreating metal layersTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2248US2024203801A1Test pad on device lead for test contactorTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2348US2025111985A1Lead structure for an inductive coilTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2448US2024322786A1Bulk Acoustic Wave (BAW) Microresonator PackageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2548US2023197575A1Die attach adhesive-ready lead frame designTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2647US2023411265A1Split semiconductor packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2747US2023378146A1Microelectronic device package with integral passive componentTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2847US2023129699A1Ic package with interface regionTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
- 2945US2024063107A1Crack arrest features for miultilevel package substrateTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 3045US2022359352A1Electronic package with concave lead end facesTEXAS INSTRUMENTS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →