Inventor · disambiguated record
Joerg Ortner
Also filed as: ORTNER JOERG
12 granted patents·3 pending applications·16 citations·filing 2009–2023
84Inventor score
Top patents by PatentIndex Score
15 records- 0187US9171806B2Method of making a semiconductor chip including identifying marksINFINEON TECHNOLOGIES AG·Filed 2014·Granted Oct 27, 2015·9 cites·19 claims
- 0282US9704748B2Method of dicing a waferINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·4 cites·35 claims
- 0368US11908763B2Apparatus having a functional structure delimited by a frame structure and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0464US9496339B2Semiconductor device comprising trench structuresINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2014·Granted Nov 15, 2016·2 cites·20 claims
- 0558US11189539B2Apparatus having a functional structure delimited by a frame structure and method for producing sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 30, 2021·0 cites·18 claims
- 0658US9165889B2Alignment mark definerINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 20, 2015·1 cites·23 claims
- 0754US9126260B2Method of processing a substrateINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 8, 2015·0 cites·19 claims
- 0853US9339868B2Method of processing a substrateINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 17, 2016·0 cites·17 claims
- 0951US9142444B2Semiconductor component and method for producing a semiconductor componentINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 22, 2015·0 cites·14 claims
- 1051US2023282596A1Semiconductor wafer and method for fabricating a semiconductor waferINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1150US2010078716A1Semiconductor component and method for producing a semiconductor componentBACHER ERWIN·Filed 2009·Application pending·0 cites
- 1248US10802404B2Reticle and exposure method including projection of a reticle pattern into neighboring exposure fieldsINFINEON TECHNOLOGIES AG·Filed 2018·Granted Oct 13, 2020·0 cites·11 claims
- 1345US11640908B2Method of implanting an implant species into a substrate at different depthsINFINEON TECHNOLOGIES AG·Filed 2020·Granted May 2, 2023·0 cites·16 claims
- 1441US9034233B2Method of processing a substrateORTNER JOERG·Filed 2010·Granted May 19, 2015·0 cites·25 claims
- 1533US2017309565A1Method of manufacturing semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →