Inventor · disambiguated record
Joonsuk Park
Also filed as: PARK JOONSUK
7 granted patents·7 pending applications·24 citations·filing 2003–2025
78Inventor score
Top patents by PatentIndex Score
14 records- 0182US10403707B2Array type inductorQUALCOMM INC·Filed 2017·Granted Sep 3, 2019·2 cites·24 claims
- 0277US9748581B2Functionalized graphene-Pt composites for fuel cells and photoelectrochemical cellsUNIV LELAND STANFORD JUNIOR·Filed 2015·Granted Aug 29, 2017·2 cites·10 claims
- 0369US2025261363A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0463US12302556B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·15 claims
- 0563US7131080B2Simulation management systemIBM·Filed 2003·Granted Oct 31, 2006·13 cites·30 claims
- 0659US2025081431A1Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0757US2025081483A1Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0856US7111275B2Electronic circuit design analysis systemIBM·Filed 2003·Granted Sep 19, 2006·7 cites·31 claims
- 0955US2024387608A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1052US2024387612A1Capacitor and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1151US12354935B2Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methodsQUALCOMM INC·Filed 2021·Granted Jul 8, 2025·0 cites·19 claims
- 1249US2024196594A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1346US11342254B2Multi-dielectric structure in two-layer embedded trace substrateQUALCOMM INC·Filed 2020·Granted May 24, 2022·0 cites·17 claims
- 1446US2023045674A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →