Inventor · disambiguated record
Joseph D. Poole
Also filed as: POOLE JOSEPH D · POOLE JOSEPH DONALD
21 granted patents·1 pending application·341 citations·filing 1991–2004
96Inventor score
Files withIBM21
Top patents by PatentIndex Score
22 records- 0187US6893591B2Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 2002·Granted May 17, 2005·34 cites·9 claims
- 0285US6590285B1Method and composition for mounting an electronic component and device formed therewithIBM·Filed 2000·Granted Jul 8, 2003·28 cites·16 claims
- 0382US6432511B1Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 1997·Granted Aug 13, 2002·49 cites·5 claims
- 0475US6499644B2Rework and underfill nozzle for electronic componentsIBM·Filed 2001·Granted Dec 31, 2002·13 cites·15 claims
- 0574US5394609AMethod and apparatus for manufacture of printed circuit cardsIBM·Filed 1993·Granted Mar 7, 1995·48 cites·15 claims
- 0667US6220503B1Rework and underfill nozzle for electronic componentsIBM·Filed 1999·Granted Apr 24, 2001·18 cites·2 claims
- 0765US6264094B1Rework and underfill nozzle for electronic componentsIBM·Filed 2000·Granted Jul 24, 2001·7 cites·10 claims
- 0862US6589376B1Method and composition for mounting an electronic component and device formed therewithIBM·Filed 1998·Granted Jul 8, 2003·19 cites·16 claims
- 0962US5820697AFluorescent water soluble solder fluxIBM·Filed 1997·Granted Oct 13, 1998·29 cites·9 claims
- 1061US6530412B1Surface mount technology with masked cureIBM·Filed 2000·Granted Mar 11, 2003·7 cites·19 claims
- 1160US5940687AWire mesh insert for thermal adhesivesIBM·Filed 1997·Granted Aug 17, 1999·21 cites·15 claims
- 1257US6464125B2Rework and underfill nozzle for electronic componentsIBM·Filed 2001·Granted Oct 15, 2002·4 cites·6 claims
- 1356US6664794B1Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufactureIBM·Filed 2000·Granted Dec 16, 2003·5 cites·4 claims
- 1453US6043110AWire mesh insert for thermal adhesivesIBM·Filed 1999·Granted Mar 28, 2000·15 cites·6 claims
- 1551US6457631B2Rework and underfill nozzle for electronic componentsIBM·Filed 2001·Granted Oct 1, 2002·2 cites·13 claims
- 1647US6139661ATwo step SMT method using masked cureIBM·Filed 1998·Granted Oct 31, 2000·9 cites·17 claims
- 1743US7645410B2Thermoplastic adhesive preform for heat sink attachmentIBM·Filed 2004·Granted Jan 12, 2010·0 cites·4 claims
- 1842US5190595AOzone safe stripping solution for thermal greaseIBM·Filed 1991·Granted Mar 2, 1993·12 cites·8 claims
- 1941US2004003882A1Method and composition for mounting an electronic component and device formed therewithFiled 2003·Application pending·0 cites
- 2038US5932031AFluorescent water soluble solder fluxIBM·Filed 1998·Granted Aug 3, 1999·8 cites·4 claims
- 2137US6054720AApparatus and method for evaluating the surface insulation resistance of electronic assembly manufactureIBM·Filed 1997·Granted Apr 25, 2000·6 cites·10 claims
- 2235US5340013ARework process for printed circuit cards and solder fountain having gas blanket for carrying out the processIBM·Filed 1993·Granted Aug 23, 1994·7 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →