Inventor · disambiguated record
Jong In Ryu
Also filed as: RYU JONG IN
18 granted patents·14 pending applications·49 citations·filing 2009–2023
91Inventor score
Files withSAMSUNG ELECTRO MECH22MICRO DIGITAL CO LTD3SAMSUNG ELECTRONICS CO LTD3RYU JONG IN2KIM MYUNG GON1
Top patents by PatentIndex Score
32 records- 0195US9868274B2Electronic device and method of fabricating exterior member for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 16, 2018·14 cites·23 claims
- 0292US9748179B2Package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Aug 29, 2017·8 cites·6 claims
- 0391US10564679B2Electronic device module, method of manufacturing the same and electronic apparatusSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 18, 2020·5 cites·20 claims
- 0490US11347273B2Electronic device module, method of manufacturing the same and electronic apparatusSAMSUNG ELECTRO MECH·Filed 2020·Granted May 31, 2022·2 cites·33 claims
- 0589US10629542B2Electronic device moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 21, 2020·7 cites·18 claims
- 0681US11209872B2Electronic device module, method of manufacturing the same and electronic apparatusSAMSUNG ELECTRO MECH·Filed 2019·Granted Dec 28, 2021·2 cites·16 claims
- 0780US10448529B2Electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 15, 2019·2 cites·6 claims
- 0877US10163746B2Semiconductor package with improved signal stability and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 25, 2018·3 cites·20 claims
- 0969US9196506B2Method for manufacturing interposerSAMSUNG ELECTRO MECH·Filed 2012·Granted Nov 24, 2015·2 cites·8 claims
- 1067US9585260B2Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Granted Feb 28, 2017·2 cites·6 claims
- 1162US10219380B2Electronic device module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2015·Granted Feb 26, 2019·1 cites·17 claims
- 1260US2025339859A1Collected sample pre-treatment device and collected sample pre-treatment methodMICRO DIGITAL CO LTD·Filed 2023·Application pending·0 cites
- 1356US8802999B2Embedded printed circuit board and manufacturing method thereofRYU JONG IN·Filed 2012·Granted Aug 12, 2014·1 cites·10 claims
- 1456US2024287499A1Cartridge system for extraction of complex sample, and complex sample extracting methodMICRO DIGITAL CO LTD·Filed 2022·Application pending·0 cites
- 1556US2024316562A1Cartridge system for extracting collected sample, and method for extracting collected sampleMICRO DIGITAL CO LTD·Filed 2022·Application pending·0 cites
- 1655US11430742B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 30, 2022·0 cites·17 claims
- 1752US2011061911A1Interposer and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1850US11251135B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 15, 2022·0 cites·18 claims
- 1950US2017301632A1Package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 2047US2014003012A1Capacitor-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2147US2013170154A1Printed circuit board having embedded capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2246US9005387B2Method for fabricating a window member of the display device of a portable terminalKIM MYUNG-GON·Filed 2012·Granted Apr 14, 2015·0 cites·18 claims
- 2344US2015131231A1Electronic component module and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2444US2014127442A1Window member for a portable terminal and method for fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 2544US2015181708A1Semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2643US9997504B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jun 12, 2018·0 cites·11 claims
- 2740US10109595B2Double-sided package module and substrate stripSAMSUNG ELECTRO MECH·Filed 2016·Granted Oct 23, 2018·0 cites·19 claims
- 2840US2013105201A1Electronic component-embedded printed circuit board and method of manufacturing the sameRYU JONG IN·Filed 2012·Application pending·0 cites
- 2939US10356911B2Electronic device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Granted Jul 16, 2019·0 cites·18 claims
- 3034US2016021737A1Electric device module and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3133US2015228625A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 3233US2016181242A1Passive device and manufacturing method thereofKOREA ELECTRONICS TECHNOLOGY·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →