Inventor · disambiguated record
Joon-Mo Seo
Also filed as: SEO JOON-MO
11 granted patents·9 pending applications·18 citations·filing 2004–2013
83Inventor score
Top patents by PatentIndex Score
20 records- 0179US7485494B2Dicing die adhesive film for semiconductorLS CABLE LTD·Filed 2006·Granted Feb 3, 2009·5 cites·12 claims
- 0267US7768141B2Dicing die attachment film and method for packaging semiconductor using sameLG INNOTEK CO LTD·Filed 2007·Granted Aug 3, 2010·4 cites·14 claims
- 0358US2009088527A1Attach paste composition for semiconductor packageLS MTRON LTD·Filed 2008·Application pending·0 cites
- 0455US7743701B2Squeeze for screen printerLG INNOTEK CO LTD·Filed 2007·Granted Jun 29, 2010·0 cites·6 claims
- 0554US9540549B2Anisotropic conductive film and semiconductor device bonded by the sameSUL KYUNG IL·Filed 2012·Granted Jan 10, 2017·1 cites·16 claims
- 0654US9390831B2Electronic device using anisotropic conductive composition and filmPARK KYOUNG SOO·Filed 2012·Granted Jul 12, 2016·0 cites·10 claims
- 0754US8766443B2Anisotropic conductive film composition, anisotropic conductive film, and semiconductor device bonded by the sameYU ARUM·Filed 2012·Granted Jul 1, 2014·1 cites·18 claims
- 0853US7968977B2Dicing film having shrinkage release film and method of manufacturing semiconductor package using the sameLG INNOTEK CO LTD·Filed 2004·Granted Jun 28, 2011·7 cites·4 claims
- 0947US9048240B2Anisotropic conductive film and electronic device including the samePARK YOUNG WOO·Filed 2012·Granted Jun 2, 2015·0 cites·18 claims
- 1045US7553701B2Semiconductor packaging methodLS MITRON LTD·Filed 2008·Granted Jun 30, 2009·0 cites·4 claims
- 1142US10504866B2Semiconductor device connected by anisotropic conductive filmPARK YOUNG WOO·Filed 2013·Granted Dec 10, 2019·0 cites·6 claims
- 1240US2007134847A1Die-attaching paste composition and method for hardening the sameKANG BYOUNG-UN·Filed 2006·Application pending·0 cites
- 1339US2010317155A1Multifunctional die attachment film and semiconductor packaging using the sameKANG BYOUNG-UN·Filed 2007·Application pending·0 cites
- 1438US2010176084A1Squeeze for screen printerKANG YOUNG-JU·Filed 2010·Application pending·0 cites
- 1536US2010087067A1Method for packaging semiconductorSEO JOON-MO·Filed 2007·Application pending·0 cites
- 1635US2009198013A1Adhesive film for semiconductorSHIN DONG-CHEON·Filed 2005·Application pending·0 cites
- 1735US2015001441A1Getter composition, and organic el display device comprising sameSEO JOON MO·Filed 2012·Application pending·0 cites
- 1834US8101527B2Dicing film having shrinkage release film and method for manufacturing semiconductor package using the sameSEO JOON MO·Filed 2010·Granted Jan 24, 2012·0 cites·3 claims
- 1934US2007101877A1Dual printing mask for screen printingSEO JOON-MO·Filed 2006·Application pending·0 cites
- 2034US2013154095A1Semiconductor devices connected by anisotropic conductive film comprising conductive microspheresYU ARUM·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →