Inventor · disambiguated record
Joseph M. Shaheen
Also filed as: SHAHEEN JOSEPH M
14 granted patents·427 citations·filing 1974–1990
94Inventor score
Top patents by PatentIndex Score
14 records- 0193US4740414ACeramic/organic multilayer interconnection boardROCKWELL INTERNATIONAL CORP·Filed 1986·Granted Apr 26, 1988·80 cites·14 claims
- 0286US4991285AMethod of fabricating multi-layer boardROCKWELL INTERNATIONAL CORP·Filed 1989·Granted Feb 12, 1991·55 cites·12 claims
- 0385US4147669AConductive adhesive for providing electrical and thermal conductivityROCKWELL INTERNATIONAL CORP·Filed 1978·Granted Apr 3, 1979·42 cites·7 claims
- 0480US3955068AFlexible conductor-resistor compositeROCKWELL INTERNATIONAL CORP·Filed 1974·Granted May 4, 1976·25 cites·8 claims
- 0579US4496215AFiber optic cableROCKWELL INTERNATIONAL CORP·Filed 1982·Granted Jan 29, 1985·44 cites·12 claims
- 0678US4233103AHigh temperature-resistant conductive adhesive and method employing sameUS AIR FORCE·Filed 1978·Granted Nov 11, 1980·35 cites·5 claims
- 0773US5123164AHermetic organic/inorganic interconnection substrate for hybrid circuit manufactureROCKWELL INTERNATIONAL CORP·Filed 1990·Granted Jun 23, 1992·47 cites·11 claims
- 0867US4052787AMethod of fabricating a beam lead flexible circuitROCKWELL INTERNATIONAL CORP·Filed 1975·Granted Oct 11, 1977·26 cites·10 claims
- 0966US4247361AMethod of etching a surface of a bodyROCKWELL INTERNATIONAL CORP·Filed 1979·Granted Jan 27, 1981·17 cites·3 claims
- 1056US4018491ACarrier for devicesROCKWELL INTERNATIONAL CORP·Filed 1976·Granted Apr 19, 1977·18 cites·10 claims
- 1150US4423467AConnection array for interconnecting hermetic chip carriers to printed circuit boards using plated-up pillarsROCKWELL INTERNATIONAL CORP·Filed 1980·Granted Dec 27, 1983·12 cites·2 claims
- 1244US4501929AMulticonductor flat cableUS AIR FORCE·Filed 1984·Granted Feb 26, 1985·9 cites·2 claims
- 1342US4548661AMethod for assembling a multiconductor flat cableUS AIR FORCE·Filed 1982·Granted Oct 22, 1985·8 cites·8 claims
- 1440US5030499AHermetic organic/inorganic interconnection substrate for hybrid circuit manufactureROCKWELL INTERNATIONAL CORP·Filed 1989·Granted Jul 9, 1991·9 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →