Inventor · disambiguated record
Jong Il Shin
Also filed as: SHIN JONG I · SHIN JONG IL
22 granted patents·3 pending applications·39 citations·filing 2002–2019
92Inventor score
Top patents by PatentIndex Score
25 records- 0190US10221065B2CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufactureINVENSENSE INC·Filed 2017·Granted Mar 5, 2019·4 cites·15 claims
- 0290US9540228B2MEMS-CMOS device that minimizes outgassing and methods of manufactureINVENSENSE INC·Filed 2015·Granted Jan 10, 2017·4 cites·12 claims
- 0386US9873663B2Fluorenyl β-oxime ester compounds, photopolymerization initiator and photoresist composition containing the sameSAMYANG CORP·Filed 2015·Granted Jan 23, 2018·4 cites·10 claims
- 0486US9738512B2CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufactureINVENSENSE INC·Filed 2015·Granted Aug 22, 2017·3 cites·8 claims
- 0585US9761557B2CMOS-MEMS integration by sequential bonding methodINVENSENSE INC·Filed 2015·Granted Sep 12, 2017·3 cites·16 claims
- 0685US9316906B2Fluorene oxime ester compound, photopolymerization initiator and photoresist composition containing the sameKOREA RES INST CHEM TECH·Filed 2013·Granted Apr 19, 2016·8 cites·8 claims
- 0783US10438758B2Trunk switch module for vehicleHYUNDAI MOTOR CO LTD·Filed 2017·Granted Oct 8, 2019·3 cites·7 claims
- 0881US9809450B2CMOS-MEMS integration using metal silicide formationINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·2 cites·19 claims
- 0977US9862593B2MEMS-CMOS device that minimizes outgassing and methods of manufactureINVENSENSE INC·Filed 2016·Granted Jan 9, 2018·1 cites·19 claims
- 1075US9975763B2Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding processINVENSENSE INC·Filed 2017·Granted May 22, 2018·1 cites·14 claims
- 1175US9725305B2Dual cavity pressure structuresINVENSENSE INC·Filed 2016·Granted Aug 8, 2017·1 cites·16 claims
- 1272US8501626B2Methods for high temperature etching a high-K material gate structureLIU WEI·Filed 2008·Granted Aug 6, 2013·4 cites·13 claims
- 1369US9611133B2Film induced interface roughening and method of producing the sameINVENSENSE INC·Filed 2015·Granted Apr 4, 2017·1 cites·28 claims
- 1464US10829367B2MEMS gap control structuresINVENSENSE INC·Filed 2019·Granted Nov 10, 2020·0 cites·14 claims
- 1562US10308503B2Dual cavity pressure structuresINVENSENSE INC·Filed 2017·Granted Jun 4, 2019·0 cites·14 claims
- 1654US11131327B2Gas lift for preventing saggingHYUNDAI MOTOR CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·9 claims
- 1748US9368550B2Application specific integrated circuit with integrated magnetic sensorINVENSENSE INC·Filed 2014·Granted Jun 14, 2016·0 cites·51 claims
- 1847US9513346B2Magnetic sensors with permanent magnets magnetized in different directionsINVENSENSE INC·Filed 2014·Granted Dec 6, 2016·0 cites·40 claims
- 1947US9513347B2Device with magnetic sensors with permanent magnetsINVENSENSE INC·Filed 2014·Granted Dec 6, 2016·0 cites·38 claims
- 2047US2013344701A1Methods for high temperature etching a high-k gate structureLIU WEI·Filed 2013·Application pending·0 cites
- 2144US2015274517A1Method to improve surface roughness and eliminate sharp corners on an actuator layer of a mems deviceINVENSENSE INC·Filed 2014·Application pending·0 cites
- 2241US6884876B2Disperse-reactive dyes containing acetoxyethylsulfone or vinylsulfone and their processKOREA RES INST CHEM TECH·Filed 2002·Granted Apr 26, 2005·0 cites·6 claims
- 2340US9718680B2CMOS-MEMS integrated device including a contact layer and methods of manufactureINVENSENSE INC·Filed 2015·Granted Aug 1, 2017·0 cites·10 claims
- 2439US10415277B2Hood latch assembly for vehicle and method of actuating the sameHYUNDAI MOTOR CO LTD·Filed 2016·Granted Sep 17, 2019·0 cites·17 claims
- 2530US2016075554A1Internal barrier for enclosed mems devicesINVENSENSE INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →