Inventor · disambiguated record
John Skrovan
Also filed as: SKROVAN JOHN · SKROVAN JOHN K
24 granted patents·1,623 citations·filing 1996–2005
97Inventor score
Files withMICRON TECHNOLOGY INC24
Top patents by PatentIndex Score
24 records- 0198US6309282B1Variable abrasive polishing pad for mechanical and chemical-mechanical planarizationMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 30, 2001·85 cites·49 claims
- 0298US6203413B1Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 1999·Granted Mar 20, 2001·189 cites·37 claims
- 0398US5645682AApparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Jul 8, 1997·209 cites·14 claims
- 0496US6361413B1Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic device substrate assembliesMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 26, 2002·56 cites·18 claims
- 0596US6136043APolishing pad methods of manufacture and useMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 24, 2000·107 cites·29 claims
- 0696US6090475APolishing pad, methods of manufacturing and useMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 18, 2000·139 cites·54 claims
- 0793US6186870B1Variable abrasive polishing pad for mechanical and chemical-mechanical planarizationMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 13, 2001·87 cites·12 claims
- 0892US6062958AVariable abrasive polishing pad for mechanical and chemical-mechanical planarizationMICRON TECHNOLOGY INC·Filed 1997·Granted May 16, 2000·116 cites·2 claims
- 0992US5846336AApparatus and method for conditioning a planarizing substrate used in mechanical and chemical-mechanical planarization of semiconductor wafersMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 8, 1998·90 cites·20 claims
- 1091US6060395APlanarization method using a slurry including a dispersantMICRON TECHNOLOGY INC·Filed 1998·Granted May 9, 2000·98 cites·9 claims
- 1191US5916819APlanarization fluid composition chelating agents and planarization method using sameMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 29, 1999·87 cites·5 claims
- 1289US5849091AMegasonic cleaning methods and apparatusMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 15, 1998·78 cites·20 claims
- 1389US5827781APlanarization slurry including a dispersant and method of using sameMICRON TECHNOLOGY INC·Filed 1996·Granted Oct 27, 1998·82 cites·25 claims
- 1484US6136218APlanarization fluid composition including chelating agentsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 24, 2000·48 cites·9 claims
- 1581US6006765AMegasonic cleaning methods and apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·47 cites·12 claims
- 1679US6048405AMegasonic cleaning methods and apparatusMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 11, 2000·43 cites·28 claims
- 1771US6110830AMethods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing methods of forming aluminum-comprising linesMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 29, 2000·33 cites·16 claims
- 1861US6277746B1Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing, and semicoductor processing methods of forming aluminum-comprising linesMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 21, 2001·6 cites·35 claims
- 1951US6391779B1Planarization processMICRON TECHNOLOGY INC·Filed 1998·Granted May 21, 2002·16 cites·36 claims
- 2049US6509272B2Planarization method using fluid composition including chelating agentsMICRON TECHNOLOGY INC·Filed 2001·Granted Jan 21, 2003·1 cites·8 claims
- 2147US7276765B2Buried transistors for silicon on insulator technologyMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·0 cites·37 claims
- 2243US6900500B2Buried transistors for silicon on insulator technologyMICRON TECHNOLOGY INC·Filed 2002·Granted May 31, 2005·1 cites·21 claims
- 2340US6739955B2Apparatus and methods for conditioning polishing pads in mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assembliesMICRON TECHNOLOGY INC·Filed 2001·Granted May 25, 2004·0 cites·37 claims
- 2440US6280924B1Planarization method using fluid composition including chelating agentsMICRON TECHNOLOGY INC·Filed 1999·Granted Aug 28, 2001·5 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →