Inventor · disambiguated record
John R. Slack
Also filed as: SLACK JOHN R · SLACK JOHN ROBERT · SLACK JR JOHN R
7 granted patents·1 pending application·520 citations·filing 1985–2021
90Inventor score
Top patents by PatentIndex Score
8 records- 0194US5926369AVertically integrated multi-chip circuit package with heat-sink supportIBM·Filed 1998·Granted Jul 20, 1999·182 cites·31 claims
- 0289US6061245AFree standing, three dimensional, multi-chip, carrier package with air flow baffleIBM·Filed 1998·Granted May 9, 2000·91 cites·14 claims
- 0386US6037658AElectronic package with heat transfer meansIBM·Filed 1997·Granted Mar 14, 2000·88 cites·40 claims
- 0486US5669775AAssembly for mounting components to flexible cablesIBM·Filed 1995·Granted Sep 23, 1997·52 cites·29 claims
- 0581US6075287AIntegrated, multi-chip, thermally conductive packaging device and methodologyIBM·Filed 1997·Granted Jun 13, 2000·70 cites·30 claims
- 0661US6256203B1Free standing, three dimensional, multi-chip, carrier package with air flow baffleIBM·Filed 1999·Granted Jul 3, 2001·22 cites·20 claims
- 0756US4602733ADesoldering apparatus and methodIBM·Filed 1985·Granted Jul 29, 1986·15 cites·8 claims
- 0835US2022417234A1Host-initiated authentication system and methodANCHOR ID INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →