Inventor · disambiguated record
Joonseo Son
Also filed as: SON JOONSEO
11 granted patents·2 pending applications·24 citations·filing 2007–2025
86Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC9FAIRCHILD SEMICONDUCTOR3FAIRCHILD KOREA SEMICONDUCTOR LTD1
Top patents by PatentIndex Score
13 records- 0191US11615967B2Power module package and method of manufacturing the sameSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Mar 28, 2023·2 cites·20 claims
- 0291US10403601B2Semiconductor package and related methodsFAIRCHILD SEMICONDUCTOR·Filed 2017·Granted Sep 3, 2019·7 cites·17 claims
- 0387US10090279B2Stray inductance reduction in packaged semiconductor devices and modulesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Oct 2, 2018·7 cites·20 claims
- 0481US11037907B2Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
- 0578US2024234246A1Integrated circuit direct cooling systems and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2024·Application pending·0 cites
- 0677US10607919B2Semiconductor package having junction cooling pipes embedded in substratesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Mar 31, 2020·2 cites·14 claims
- 0775US2025149512A1Semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2025·Application pending·0 cites
- 0872US12230606B2Semiconductor package and related methodsFAIRCHILD SEMICONDUCTOR·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 0971US11967540B2Integrated circuit direct cooling systems having substrates in contact with a cooling mediumSEMICONDUCTOR COMPONENTS IND LLC·Filed 2021·Granted Apr 23, 2024·0 cites·18 claims
- 1067US11201105B2Semiconductor package having a spacer with a junction cooling pipeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Dec 14, 2021·0 cites·12 claims
- 1166US7586179B2Wireless semiconductor package for efficient heat dissipationFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 8, 2009·4 cites·13 claims
- 1264US11101198B2Semiconductor die package including a one-body clipSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Aug 24, 2021·0 cites·21 claims
- 1353US10586754B2Semiconductor die package and manufacturing methodFAIRCHILD KOREA SEMICONDUCTOR LTD·Filed 2017·Granted Mar 10, 2020·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Joonseo Son files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →