Inventor · disambiguated record
John Y. Spann
Also filed as: SPANN JOHN · SPANN JOHN Y
13 granted patents·105 citations·filing 2013–2021
90Inventor score
Top patents by PatentIndex Score
13 records- 0196US9882073B2Structures for bonding a direct-bandgap chip to a silicon photonic deviceSKORPIOS TECH INC·Filed 2014·Granted Jan 30, 2018·19 cites·10 claims
- 0296US9316785B2Integration of an unprocessed, direct-bandgap chip into a silicon photonic deviceSKORPIOS TECHNOLOGIES INC·Filed 2014·Granted Apr 19, 2016·33 cites·11 claims
- 0395US9209142B1Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removalSKORPIOS TECHNOLOGIES INC·Filed 2014·Granted Dec 8, 2015·24 cites·15 claims
- 0492US9496431B2Coplanar integration of a direct-bandgap chip into a silicon photonic deviceSKORPIOS TECH INC·Filed 2014·Granted Nov 15, 2016·9 cites·12 claims
- 0588US11181688B2Integration of an unprocessed, direct-bandgap chip into a silicon photonic deviceSKORPIOS TECH INC·Filed 2016·Granted Nov 23, 2021·5 cites·20 claims
- 0687US9923105B2Processing of a direct-bandgap chip after bonding to a silicon photonic deviceSKORPIOS TECH INC·Filed 2014·Granted Mar 20, 2018·5 cites·8 claims
- 0783US10833480B2Diffusion blocking layer for a compound semiconductor structureSKORPIOS TECH INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 0876US9324682B2Method and system for height registration during chip bondingSKORPIOS TECHNOLOGIES INC·Filed 2014·Granted Apr 26, 2016·4 cites·16 claims
- 0975US9568750B2Hybrid optical modulatorSKORPIOS TECH INC·Filed 2013·Granted Feb 14, 2017·3 cites·16 claims
- 1074US9991149B2Semiconductor bonding with compliant resin and utilizing hydrogen implantation for transfer-wafer removalSKORPIOS TECH INC·Filed 2015·Granted Jun 5, 2018·2 cites·20 claims
- 1172US12287510B2Integration of an unprocessed, direct-bandgap chip into a silicon photonic deviceSKORPIOS TECH INC·Filed 2021·Granted Apr 29, 2025·0 cites·20 claims
- 1272US11557880B2Diffusion blocking layer for a compound semiconductor structureSKORPIOS TECH INC·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 1342US10243314B2Semiconductor layer variation for substrate removal after bondingSKORPIOS TECH INC·Filed 2016·Granted Mar 26, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →