Inventor · disambiguated record
Joshua Stacey
Also filed as: STACEY JOSHUA · STACEY JOSHUA J · STACEY JOSHUA JAMES
2 granted patents·26 pending applications·0 citations·filing 2020–2024
22Inventor score
Top patents by PatentIndex Score
28 records- 0161US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0258US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0358US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0458US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0558US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0657US2025279346A1High aspect ratio vias with low stress in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 0756US2024173953A1Method and apparatus for laminating a film on a substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 0856US2025218929A1Embedded deep trench capacitors in integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 0955US2025218955A1Microelectronic structures including embedded glass patch with integrated capacitorINTEL CORP·Filed 2023·Application pending·0 cites
- 1055US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1155US2025379163A1Microelectronic assemblies having a glass layer substrate with integrated capacitorsINTEL CORP·Filed 2024·Application pending·0 cites
- 1253US2025349729A1Microelectronic assemblies with double liners in through-glass viasINTEL CORP·Filed 2024·Application pending·0 cites
- 1353US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 1453US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 1552US2025219041A1Technologies for memory and power components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1652US2025112163A1Through-glass via liners for integrated circuit device packagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1751US2024222295A1Stacked inorganic-organic dielectrics for thin film capacitors in package substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1851US2025112175A1Microelectronic assemblies with edge stress reduction in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1951US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 2050US2025112140A1Stress mitigation architectures for glass core substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2149US12214579B2Dry film lamination with dynamic feedback controlINTEL CORP·Filed 2022·Granted Feb 4, 2025·0 cites·19 claims
- 2249US2024105476A1System for coating methodINTEL CORP·Filed 2022·Application pending·0 cites
- 2348US2025206659A1Apparatus and system for coating of glass substrate having a plurality of through-holesINTEL CORP·Filed 2023·Application pending·0 cites
- 2448US2024186136A1Polymeric films as an adhesive promotion/buffer layer at glass-dielectric or metal-dielectric interfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 2547US2024096561A1Thin film capacitorsINTEL CORP·Filed 2022·Application pending·0 cites
- 2645US2024186229A1Integrated circuit package architectures with core and/or build-up layers comprising spin-on glass (sog)INTEL CORP·Filed 2022·Application pending·0 cites
- 2744US2024079530A1Ic package with micro ledsINTEL CORP·Filed 2022·Application pending·0 cites
- 2838US12266581B2Electronic substrates having heterogeneous dielectric layersINTEL CORP·Filed 2020·Granted Apr 1, 2025·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →