Inventor · disambiguated record
Jörg Strogies
Also filed as: STROGIES JÖRG
9 granted patents·11 pending applications·1 citations·filing 2017–2024
74Inventor score
Top patents by PatentIndex Score
20 records- 0167US11373984B2Power module having a power electronics device on a substrate board, and power electronics circuit having such a power moduleSIEMENS AG·Filed 2019·Granted Jun 28, 2022·1 cites·13 claims
- 0259US2025201666A1Power Module For An Electronic Computing DeviceSIEMENS AG·Filed 2024·Application pending·0 cites
- 0351US2025380362A1Circuit assembly with two circuit carriers and a semiconductor componentSIEMENS AG·Filed 2023·Application pending·0 cites
- 0449US12341127B2Semifinished product for populating with components and, method for populating same with componentsSIEMENS AG·Filed 2020·Granted Jun 24, 2025·0 cites·11 claims
- 0549US2025385228A1Power Electronics Assembly Comprising Power Modules That Can Be Fitted with ComponentsSIEMENS AG·Filed 2023·Application pending·0 cites
- 0647US2024379508A1Power Electronics AssemblySIEMENS AG·Filed 2022·Application pending·0 cites
- 0746US2024038621A1Device Comprising a Component and a Coupled Cooling BodySIEMENS AG·Filed 2021·Application pending·0 cites
- 0845US11373804B2Capacitor structure and power module having a power electronic componentSIEMENS AG·Filed 2019·Granted Jun 28, 2022·0 cites·13 claims
- 0943US11564310B2Vibration-damped circuit arrangement, converter, and aircraft having such an arrangementROLLS ROYCE DEUTSCHLAND LTD & CO KG·Filed 2019·Granted Jan 24, 2023·0 cites·13 claims
- 1043US2023215838A1Joining and Insulating Power Electronic Semiconductor ComponentsSIEMENS AG·Filed 2021·Application pending·0 cites
- 1141US11282822B2Power electronic circuit having a plurality of power modulesSIEMENS AG·Filed 2019·Granted Mar 22, 2022·0 cites·15 claims
- 1240US11289425B2Semiconductor component and method for producing sameSIEMENS AG·Filed 2018·Granted Mar 29, 2022·0 cites·9 claims
- 1340US11212918B2Electrical assemblySIEMENS AG·Filed 2018·Granted Dec 28, 2021·0 cites·5 claims
- 1440US2020139490A1Solder Preform for Diffusion Soldering, Method for the Production thereof, and Method for the Assembly ThereofSIEMENS AG·Filed 2018·Application pending·0 cites
- 1539US2022285311A1Installing an Electronic AssemblySIEMENS AG·Filed 2020·Application pending·0 cites
- 1638US11285568B2Solder preform for establishing a diffusion solder connection and method for producing a solder preformSIEMENS AG·Filed 2018·Granted Mar 29, 2022·0 cites·14 claims
- 1737US10420220B2Electronic assembly with a component arranged between two circuit carriers, and method for joining such an assemblySIEMENS AG·Filed 2017·Granted Sep 17, 2019·0 cites·14 claims
- 1837US2020152532A1Electronic Assembly With a Component Located Between Two Substrates, and Method for Producing SameSIEMENS AG·Filed 2018·Application pending·0 cites
- 1933US2021021179A1Circuit arrangement having a spacer element, converter and aircraft with such a circuit arrangement, and method for current measurementBLANK RENE·Filed 2019·Application pending·0 cites
- 2032US2021039182A1Method for Producing a Structural Unit and Method for Connecting a Component to such a Structural UnitSIEMENS AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →